Copper Interconnects and Reliability
Copper Interconnects and Reliability is a research topic within Electronic, Optical and Magnetic Materials. Science Explorer counts 27k research works in it since 1950. 11.7% of them reached the world's top 10% most cited for their field and year.
This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.
- Low-k Dielectrics
- Microelectronics
- Electromigration
- Copper Metallization
- Interconnect Scaling
- Thin Films
- Electrical Resistivity
- Plasma Processing
- Diffusion Barriers
- Nanowires
- Research works
- 27k fractional, since 1950
- In the world top 10%
- 3.2k per year above
- Top-10% rate
- 11.7% share of its works in the world top 10%
- Growth, 2013–17 → 2018–22
- -28% the tick is no change
Which countries lead Copper Interconnects and Reliability research?
By volume, China and the United States publish the most (513 and 273 works in 2022–2025).
By volume, 2022–2025
- 1 China 513 works
- 2 United States 273 works
- 3 Japan 175 works
- 4 South Korea 136 works
- 5 Taiwan 107 works
- 6 Germany 105 works
- 7 Russia 76 works
- 8 France 64 works
- 9 India 56 works
- 10 Belgium 49 works
How concentrated that is
The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.
Shares of the rows listed above, not of the whole node.
Which institutions lead Copper Interconnects and Reliability research?
By volume in 2022–2025, IMEC publishes the most Copper Interconnects and Reliability research, followed by National Yang Ming Chiao Tung University and Samsung (South Korea).
By volume, 2022–2025
- 1 IMECBelgium 31 works
- 2 National Yang Ming Chiao Tung UniversityTaiwan 19 works
- 3 Samsung (South Korea)South Korea 18 works
- 4 Chinese Academy of SciencesChina 18 works
- 5 Shanghai Jiao Tong UniversityChina 16 works
- 6 Hanyang UniversitySouth Korea 14 works
- 7 The University of OsakaJapan 14 works
- 8 National Tsing Hua UniversityTaiwan 13 works
- 9 Harbin Institute of TechnologyChina 12 works
- 10 Tohoku UniversityJapan 12 works
Who are the leading researchers in Copper Interconnects and Reliability?
The most-cited researchers publishing on Copper Interconnects and Reliability include Huan Liu.
- 1 Huan Liu Australia 4.9k citations
Ranked by citations received across their whole record, among researchers with at least three works on this topic.
Where is Copper Interconnects and Reliability research done?
The largest centres of Copper Interconnects and Reliability research in 2022–2025 are Beijing (China), Seoul (South Korea), Shanghai (China) and Tokyo (Japan). Among places with at least 20 works in it, it is an unusually large share of all research in Hsinchu and Leuven.
Largest cities, 2022–2025
Where it is the local speciality
- HsinchuTW · 46.2 works30×
- LeuvenBE · 40.0 works21×
Location quotient: how much more of its research is in Copper Interconnects and Reliability than the world average.
Where is the best place to study Copper Interconnects and Reliability?
Among universities, judged by research, National Yang Ming Chiao Tung University, Seoul National University of Science and Technology and Hanyang University score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.
One dot per university in the table below. The upper left is the interesting corner: small places doing unusually strong work.
| # | University | Score | Top 10% | Specialisation | Works | Growth |
|---|---|---|---|---|---|---|
| 1 | National Yang Ming Chiao Tung UniversityTaiwan | 74.1 | 12.8% | 26.7× | 20 | -23.7% |
| 2 | Seoul National University of Science and TechnologySouth Korea | 56.3 | 7.5% | 41.8× | 10 | +60.8% |
| 3 | Hanyang UniversitySouth Korea | 49.9 | 5.3% | 18.6× | 14 | -25.9% |
| 4 | The University of OsakaJapan | 49.5 | 5.5% | 12.3× | 14 | -11.4% |
| 5 | Sungkyunkwan UniversitySouth Korea | 49.5 | 9.4% | 9.1× | 9 | -40.9% |
| 6 | National Tsing Hua UniversityTaiwan | 47.1 | 5.2% | 29.1× | 13 | -40.8% |
| 7 | Tohoku UniversityJapan | 35.6 | 1.0% | 10.2× | 12 | -27.2% |
| 8 | University of Chinese Academy of SciencesChina | 33.6 | 6.7% | 2.9× | 8 | +118.3% |
| 9 | National Cheng Kung UniversityTaiwan | 32.7 | 1.2% | 14.7× | 9 | -29.1% |
| 10 | Shanghai Jiao Tong UniversityChina | 26.8 | 3.9% | 4.0× | 16 | -18.6% |
Universities only. Score blends excellence (30%), specialisation (25%), size (20%), growth (15%) and international reach (10%), 2015–2022; growth compares 2010–14 with 2015–19.
Is Copper Interconnects and Reliability research growing?
Output in 2018–2022 was 28% lower than in 2013–2017, peaking in 2002.
The same series as a ribbon — one cell per year, darker for more. The line above answers how much; this answers when.
Which topics inside it are moving
Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.