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Topic · Electronic, Optical and Magnetic Materials

Copper Interconnects and Reliability

Copper Interconnects and Reliability is a research topic within Electronic, Optical and Magnetic Materials. Science Explorer counts 27k research works in it since 1950. 10.0% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.

  • Low-k Dielectrics
  • Microelectronics
  • Electromigration
  • Copper Metallization
  • Interconnect Scaling
  • Thin Films
  • Electrical Resistivity
  • Plasma Processing
  • Diffusion Barriers
  • Nanowires
Research works
27k
fractional, since 1950
In the world top 10%
2.7k
per year above
Top-10% rate
10.0%
share of its works in the world top 10%
Growth, 2018-21 → 2022-25
+12%
the tick is no change
Largest producer
China
35% of the 10 largest, 2022-now
Copper Interconnects and Reliability

Which countries lead Copper Interconnects and Reliability research?

By volume, China and the United States publish the most (705 and 348 works in 2022-now).

By volume, 2022-now

  1. 1 China 705 works
  2. 2 United States 348 works
  3. 3 Japan 223 works
  4. 4 South Korea 193 works
  5. 5 Taiwan 137 works
  6. 6 Germany 125 works
  7. 7 Russia 85 works
  8. 8 France 76 works
  9. 9 India 70 works
  10. 10 Belgium 57 works

How concentrated that is

The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.

China: 35.0%United States: 17.3%Japan: 11.0%South Korea: 9.6%6 others listed: 27.2%35%largest
China705 · 35.0%United States348 · 17.3%Japan223 · 11.0%South Korea193 · 9.6%6 others listed548 · 27.2%

Shares of the rows listed above, not of the whole node.

Which institutions lead Copper Interconnects and Reliability research?

By volume in 2022-now, Chinese Academy of Sciences publishes the most Copper Interconnects and Reliability research, followed by IMEC and Centre National de la Recherche Scientifique.

By volume, 2022-now

  1. 1 Chinese Academy of SciencesChina 59 works
  2. 2 IMECBelgium 37 works
  3. 3 Centre National de la Recherche ScientifiqueFrance 34 works
  4. 4 Russian Academy of SciencesRussia 31 works
  5. 5 Samsung (South Korea)South Korea 27 works
  6. 6 National Yang Ming Chiao Tung UniversityTaiwan 24 works
  7. 7 Hanyang UniversitySouth Korea 19 works
  8. 8 Shanghai Jiao Tong UniversityChina 19 works
  9. 9 National Tsing Hua UniversityTaiwan 18 works
  10. 10 Harbin Institute of TechnologyChina 17 works

Who are the leading researchers in Copper Interconnects and Reliability?

The most-cited researchers publishing on Copper Interconnects and Reliability include Zhong Lin Wang, Georg Kresse and Wei Huang.

  1. 1 Zhong Lin Wang United States 491k citations
  2. 2 Georg Kresse Austria 431k citations
  3. 3 Wei Huang China 267k citations
  4. 4 Jean‐Louis Vincent Belgium 262k citations
  5. 5 Xiaogang Wang China 260k citations
  6. 6 Ralph B. D’Agostino United States 255k citations
  7. 7 Kenji Watanabe Japan 237k citations
  8. 8 Takashi Taniguchi Japan 227k citations
  9. 9 Jürgen Furthmüller Germany 217k citations
  10. 10 Hua Zhang Singapore 196k citations

Ranked by citations received across their whole record, among researchers with at least three works on this topic.

What are the most cited papers in Copper Interconnects and Reliability?

The most cited paper in Copper Interconnects and Reliability is "Enhanced magnetoresistance in layered magnetic structures with antiferromagnetic interlayer exchange" (G. Binasch, P. Grünberg, Frank Saurenbach et al., 1989), with 4,300 citations. Next come "Ultrahigh Strength and High Electrical Conductivity in Copper" (3,389) and ""Special points for Brillouin-zone integrations"—a reply" (3,336).

Most cited papers
#PaperReleasedCitations
1 Enhanced magnetoresistance in layered magnetic structures with antiferromagnetic interlayer exchange G. Binasch, P. Grünberg, Frank Saurenbach et al. · Physical review. B, Condensed matter Mar 1989 4,300
2 Ultrahigh Strength and High Electrical Conductivity in Copper Lei Lu, Y.F. Shen, Xianhua Chen et al. · Science 22 Mar 2004 3,389
3 "Special points for Brillouin-zone integrations"—a reply J.D. Pack, Hendrik J. Monkhorst · Physical review. B, Solid state 15 Aug 1977 3,336
4 The mean free path of electrons in metals E. H. Sondheimer · Advances In Physics 1952 2,617
5 Microscopic Theory of Superconductivity J. Bardeen, Leon N. Cooper, J. R. Schrieffer · Physical Review Apr 1957 2,612
All 100 most cited papers, with filters and sorting

Where is Copper Interconnects and Reliability research done?

The largest centres of Copper Interconnects and Reliability research in 2022-now are Beijing (China), Seoul (South Korea), Shanghai (China) and Tokyo (Japan). Among places with at least 20 works in it, it is an unusually large share of all research in Santa Clara, Hsinchu and Leuven.

Largest cities, 2022-now

  1. 1 BeijingChina 138 works
  2. 2 SeoulSouth Korea 111 works
  3. 3 ShanghaiChina 77 works
  4. 4 TokyoJapan 75 works
  5. 5 HsinchuTaiwan 59 works
  6. 6 LeuvenBelgium 46 works
  7. 7 Xi'anChina 35 works
  8. 8 MoscowRussia 35 works
  9. 9 WuhanChina 32 works
  10. 10 SingaporeSingapore 32 works

Where it is the local speciality

  1. Santa ClaraUS · 21.7 works36×
  2. HsinchuTW · 59.3 works30×
  3. LeuvenBE · 45.6 works18×
← less than its size predicts1×more →

Location quotient: how much more of its research is in Copper Interconnects and Reliability than the world average.

See Copper Interconnects and Reliability on the map

Where is the best place to study Copper Interconnects and Reliability?

Among universities, judged by research, National Yang Ming Chiao Tung University, City University of Hong Kong and Seoul National University of Science and Technology score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.

0%20%40%mean 19.85%fractional works in this field (log) →share of work in the world top 10% →National Yang Ming C…City University of H…Seoul National Unive…Hanyang University
above the meannear itbelow it

One dot per university in the first ten of the table below, at the default weights. The upper left is the interesting corner: small places doing unusually strong work.

Excellenceshare of its work in the world top 10%, 2022-now and all time averaged
40%
Specialisationhow much of its work is in this field, counted up to 10× the world share
10%
Sizeits output in this field, on a log scale
30%
Growthoutput growth, counted from -20% to +20%
10%
Internationalshare of its work with a co-author abroad
10%
Each slider sets a weight; the share it gets of the score is beside it.
#UniversityScoreTop 10%SpecialisationWorksGrowth
1National Yang Ming Chiao Tung UniversityTaiwan 89.032.1%28.4×24 +16.6%
2City University of Hong KongChina 67.730.8%6.8×8 +274.7%
3Seoul National University of Science and TechnologySouth Korea 66.021.0%49.3×14 +95.8%
4Hanyang UniversitySouth Korea 59.714.4%21.1×19 +92.5%
5Harbin Institute of TechnologyChina 57.018.8%5.0×17 +64.2%
6National Tsing Hua UniversityTaiwan 53.49.2%35.7×18 +50.5%
7Shanghai Jiao Tong UniversityChina 51.012.2%3.2×19 +63.6%
8Huazhong University of Science and TechnologyChina 49.819.1%3.8×14 +118.8%
9Purdue University West LafayetteUnited States 47.122.6%4.2×8 +4.4%
10Hebei University of TechnologyChina 46.018.3%10.9×9 +81.4%

Universities only. The score blends excellence (40%), size (30%), specialisation (10%), growth (10%), international reach (10%), 2022-now; growth compares 2018-21 with 2022-25 and counts up to +20%, since a jump from a small base is mostly noise.

Every institution in Copper Interconnects and Reliability, country by country

Is Copper Interconnects and Reliability research growing?

Output in 2022-2025 was 12% higher than in 2018-2021, peaking in 2002. The fastest-growing topics are Copper Interconnects and Reliability.

still counting19801990200020102020
grewheldshrank

The same series as a ribbon: one cell per year, darker for more. The line above answers how much; this answers when.

Its share of all research

Growing output can still be a shrinking share: all of science grows. This is Copper Interconnects and Reliability as a percentage of every work published that year, 0.0080% in 2024.

still counting0.025%0.050%0.075%Copper Interconnects and Reliability0.011% in 202519801990200020102020

Fractional works of Copper Interconnects and Reliability over all fractional works that year. How the balance of science has shifted.

How much of it reaches the world top 10%

Year by year.

still counting5%10%15%Copper Interconnects and Reliability10.0% in 2025200020102020

Of each year's works in it, the share that reached the world's 10% most cited for their field and year. A field is the world for its own topics, so there is no other line to hold it against.

Which topics inside it are moving

Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.

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