Angelika Schingale
Angelika Schingale publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #6,878,996 of 7,710,434 ranked researchers
- Rank in Germany
- #339,648 of 364,343
- Works
- 18
- Citations
- 69
- Citations per work
- 3.8
What does Angelika Schingale research?
Angelika Schingale's work is mostly in Engineering (74%), Computer Science (10%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1584.0%
- Engineering1374.0%
- Computer Science210.0%
- Everything else316.0%
- 1Electrical and Electronic Engineering46% of their works
- 2Mechanical Engineering16% of their works
- 3Mechanics of Materials8% of their works
- 4Hardware and Architecture6% of their works
- 5Computer Networks and Communications4% of their works
- 6Civil and Structural Engineering4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Epoxy Resin Curing Processes
- Injection Molding Process and Properties
- Mechanical Behavior of Composites
- Cryptographic Implementations and Security
Which keywords describe Angelika Schingale's research?
The keywords of their largest research topics: High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via, Electromagnetic Compatibility and EMI.
- Cryptanalysis
- Wide Bandgap Semiconductors
- Polybenzoxazines
- Injection Molding
- Delamination
- Electromagnetic Compatibility
- Through-Silicon Via
- Thermal Management
- Interfacial Reactions
- High-Temperature Electronics
- Lead-free Solders
- Interconnect
- EMI
- Cohesive Zone Models
- Epoxy Resins
- Optimization
- Reliability
- Block Ciphers
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- High-Temperature Electronics122 topics
- Interfacial Reactions91 topic
- Lead-free Solders91 topic
- Thermal Management82 topics
- Interconnect51 topic
- Through-Silicon Via51 topic
- EMI41 topic
- Electromagnetic Compatibility41 topic
- Cohesive Zone Models31 topic
- Delamination31 topic
- Epoxy Resins31 topic
- Injection Molding31 topic
- Optimization31 topic
- Polybenzoxazines31 topic
- Reliability31 topic
- Wide Bandgap Semiconductors31 topic
- Block Ciphers11 topic
- Cryptanalysis11 topic
Where does Angelika Schingale work?
Angelika Schingale's main affiliation in the publication record is Continental (Germany), Germany.
How many publications and citations does Angelika Schingale have?
OpenAlex counts 18 works and 69 citations for Angelika Schingale, an h-index of 5, ranking #6,878,996 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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