Bernd Roelfs
Bernd Roelfs publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Copper Interconnects and Reliability.
- World rank
- #5,485,913 of 7,710,434 ranked researchers
- Rank in Germany
- #283,291 of 364,343
- Works
- 26
- Citations
- 359
- Citations per work
- 13.8
What does Bernd Roelfs research?
Bernd Roelfs's work is mostly in Engineering (56%), Materials Science (21%), Physics and Astronomy (6%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2387.0%
- Engineering1555.8%
- Materials Science520.8%
- Physics and Astronomy26.5%
- Chemistry13.9%
- Everything else313.0%
- 1Electrical and Electronic Engineering52% of their works
- 2Electronic, Optical and Magnetic Materials14% of their works
- 3Atomic and Molecular Physics, and Optics6% of their works
- 4Materials Chemistry6% of their works
- 5Electrochemistry4% of their works
- 6Biomedical Engineering4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Electrodeposition and Electroless Coatings
- Molecular Junctions and Nanostructures
- Electrochemical Analysis and Applications
- Additive Manufacturing and 3D Printing Technologies
- Surface Chemistry and Catalysis
Which keywords describe Bernd Roelfs's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Additive Manufacturing, Interconnect, Low-k Dielectrics and Microelectronics.
- Nanostructures
- Electrochemical
- 3D Printing
- Molecular Electronics
- Composite Coatings
- Microelectronics
- Interconnect
- Lead-free Solders
- Nanoparticles
- Electromigration
- Interfacial Reactions
- Additive Manufacturing
- Low-k Dielectrics
- Through-Silicon Via
- Electrodeposition
- Self-Assembled Monolayers
- Detection
- Materials
- Surface
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Electromigration232 topics
- Nanoparticles222 topics
- Interfacial Reactions131 topic
- Lead-free Solders131 topic
- Additive Manufacturing122 topics
- Interconnect101 topic
- Low-k Dielectrics101 topic
- Microelectronics101 topic
- Through-Silicon Via101 topic
- Composite Coatings91 topic
- Electrodeposition91 topic
- Molecular Electronics71 topic
- Self-Assembled Monolayers71 topic
- 3D Printing31 topic
- Detection31 topic
- Electrochemical31 topic
- Materials31 topic
- Nanostructures31 topic
- Surface31 topic
Where does Bernd Roelfs work?
Bernd Roelfs's main affiliation in the publication record is Atotech (Germany), Germany.
How many publications and citations does Bernd Roelfs have?
OpenAlex counts 26 works and 359 citations for Bernd Roelfs, an h-index of 9, ranking #5,485,913 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Bernd Roelfs. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.