Question 1

What does Bernhard Rebhan research?

Accepted Answer

Bernhard Rebhan publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.

Question 2

Which keywords describe Bernhard Rebhan's research?

Accepted Answer

The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Chemical Mechanical Planarization.

Question 3

Where does Bernhard Rebhan work?

Accepted Answer

Bernhard Rebhan's main affiliation in the publication record is EV Group (Austria), Austria.

Question 4

How many publications and citations does Bernhard Rebhan have?

Accepted Answer

OpenAlex counts 43 works and 432 citations for Bernhard Rebhan, an h-index of 12, ranking #5,234,651 of 7,710,434 researchers worldwide on the quality score.

Question 5

Is Bernhard Rebhan's h-index high?

Accepted Answer

An h-index of 12 is at or above that of 63% of the 398,464 ranked researchers whose main subfield is Electrical and Electronic Engineering, which is in the top 41%.