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Researcher · EV Group (Austria) · Austria

Bernhard Rebhan

Bernhard Rebhan publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.

ORCID 0000-0001-7080-7000 OpenAlex
World rank
#5,234,651
of 7,710,434 ranked researchers
Rank in Austria
#32,334
of 43,330
Works
43
Citations
432
Citations per work
10.0
h-index
12
i10-index 13Top 41% in Electrical and Electronic Engineering
Bernhard Rebhan

What does Bernhard Rebhan research?

Bernhard Rebhan's work is mostly in Engineering (86%), Materials Science (5%), Physics and Astronomy (2%).

Physical Sciences: 40 works · 92.9% of their workEngineering: 37 works · 85.7% of their workElectrical and Electronic Engineering: 28 works · 65.1% of their workAutomotive Engineering: 4 works · 8.7% of their workBiomedical Engineering: 3 works · 7.1% of their workMechanical Engineering: 2 works · 4.8% of their workMaterials Science: 2 works · 4.8% of their workElectronic, Optical and Magnetic Materials: 2 works · 4.8% of their workPhysics and Astronomy: 1 works · 2.4% of their workAtomic and Molecular Physics, and Optics: 1 works · 2.4% of their workEverything else: 3 works · 7.1% of their workTHEIR WORKBernhard Rebhan43works
Physical Sciences93%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3785.7%
    2. Materials Science24.8%
    3. Physics and Astronomy12.4%
  2. Everything else37.1%
  1. 1Electrical and Electronic Engineering65% of their works
  2. 2Automotive Engineering9% of their works
  3. 3Biomedical Engineering7% of their works
  4. 4Mechanical Engineering5% of their works
  5. 5Electronic, Optical and Magnetic Materials5% of their works
  6. 6Atomic and Molecular Physics, and Optics2% of their works

Research topics

Which keywords describe Bernhard Rebhan's research?

The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Chemical Mechanical Planarization.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Interconnect391 topic
  2. Through-Silicon Via391 topic
  3. Electromigration362 topics
  4. Interfacial Reactions301 topic
  5. Lead-free Solders301 topic
  6. 3D Printing111 topic
  7. Additive Manufacturing111 topic
  8. Chemical Mechanical Planarization71 topic
  9. Material Removal Mechanism71 topic
  10. Low-k Dielectrics61 topic
  11. Microelectronics61 topic
  12. Ceramic Materials31 topic
  13. Friction Stir Welding31 topic
  14. Processing31 topic
  15. Silicon31 topic
  16. Sintering31 topic
  17. Solar Cells31 topic

Where does Bernhard Rebhan work?

Bernhard Rebhan's main affiliation in the publication record is EV Group (Austria), Austria.

How many publications and citations does Bernhard Rebhan have?

OpenAlex counts 43 works and 432 citations for Bernhard Rebhan, an h-index of 12, ranking #5,234,651 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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