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Researcher · Engineering Associates (United States) · United States

Bernie Siegal

Bernie Siegal publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Heat Transfer and Optimization.

OpenAlex
World rank
#6,604,016
of 7,710,434 ranked researchers
Rank in United States
#1,536,883
of 1,627,098
Works
20
Citations
162
Citations per work
8.1
h-index
8
i10-index 6Top 66% in Electrical and Electronic Engineering
Bernie Siegal

What does Bernie Siegal research?

Bernie Siegal's work is mostly in Engineering (73%), Materials Science (10%), Physics and Astronomy (3%).

Physical Sciences: 17 works · 86.5% of their workEngineering: 15 works · 72.9% of their workElectrical and Electronic Engineering: 11 works · 54.2% of their workMechanical Engineering: 2 works · 11.9% of their workAutomotive Engineering: 1 works · 3.4% of their workCivil and Structural Engineering: 1 works · 3.4% of their workMaterials Science: 2 works · 10.2% of their workMaterials Chemistry: 2 works · 10.2% of their workPhysics and Astronomy: 1 works · 3.4% of their workAtomic and Molecular Physics, and Optics: 1 works · 3.4% of their workEverything else: 3 works · 13.5% of their workTHEIR WORKBernie Siegal20works
Physical Sciences86%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1572.9%
    2. Materials Science210.2%
    3. Physics and Astronomy13.4%
  2. Everything else313.5%
  1. 1Electrical and Electronic Engineering54% of their works
  2. 2Mechanical Engineering12% of their works
  3. 3Materials Chemistry10% of their works
  4. 4Civil and Structural Engineering3% of their works
  5. 5Atomic and Molecular Physics, and Optics3% of their works
  6. 6Automotive Engineering3% of their works

Research topics

Which keywords describe Bernie Siegal's research?

The keywords of their largest research topics: Thermal Management, High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Numerical Simulation, Interconnect, Through-Silicon Via and Graphene.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 19 words, with their numbers
  1. Thermal Management224 topics
  2. High-Temperature Electronics132 topics
  3. Interfacial Reactions101 topic
  4. Lead-free Solders101 topic
  5. Numerical Simulation82 topics
  6. Interconnect71 topic
  7. Through-Silicon Via71 topic
  8. Graphene61 topic
  9. Heat Transfer61 topic
  10. Microchannel61 topic
  11. Thermal Conductivity61 topic
  12. Reliability31 topic
  13. Wide Bandgap Semiconductors31 topic
  14. Design Optimization21 topic
  15. Optical Modulators21 topic
  16. Silicon Photonics21 topic
  17. Sound Quality21 topic
  18. Structural Analysis21 topic
  19. Transfer Path Analysis21 topic

Where does Bernie Siegal work?

Bernie Siegal's main affiliation in the publication record is Engineering Associates (United States), United States.

How many publications and citations does Bernie Siegal have?

OpenAlex counts 20 works and 162 citations for Bernie Siegal, an h-index of 8, ranking #6,604,016 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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