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Researcher · Technische Universität Dresden · Germany

Bjoern Boehme

Bjoern Boehme publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.

OpenAlex
World rank
#6,372,840
of 7,710,434 ranked researchers
Rank in Germany
#322,125
of 364,343
Works
27
Citations
188
Citations per work
7.0
h-index
8
i10-index 3Top 66% in Electrical and Electronic Engineering
Bjoern Boehme

What does Bjoern Boehme research?

Bjoern Boehme's work is mostly in Engineering (88%), Materials Science (3%).

Physical Sciences: 25 works · 91.0% of their workEngineering: 24 works · 88.4% of their workElectrical and Electronic Engineering: 13 works · 49.4% of their workMechanical Engineering: 4 works · 13.0% of their workMechanics of Materials: 4 works · 13.0% of their workBiomedical Engineering: 3 works · 10.4% of their workCivil and Structural Engineering: 1 works · 2.6% of their workMaterials Science: 1 works · 2.6% of their workGeneral Materials Science: 1 works · 2.6% of their workEverything else: 2 works · 9.0% of their workTHEIR WORKBjoern Boehme27works
Physical Sciences91%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2488.4%
    2. Materials Science12.6%
  2. Everything else29.0%
  1. 1Electrical and Electronic Engineering49% of their works
  2. 2Mechanical Engineering13% of their works
  3. 3Mechanics of Materials13% of their works
  4. 4Biomedical Engineering10% of their works
  5. 5General Materials Science3% of their works
  6. 6Civil and Structural Engineering3% of their works

Research topics

Which keywords describe Bjoern Boehme's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Failure Analysis, Guided Lamb Waves, Integrated Circuits and Piezoelectric Impedance-Based Health Monitoring.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 16 words, with their numbers
  1. Interfacial Reactions181 topic
  2. Lead-free Solders181 topic
  3. Interconnect131 topic
  4. Through-Silicon Via131 topic
  5. Failure Analysis41 topic
  6. Guided Lamb Waves41 topic
  7. Integrated Circuits41 topic
  8. Piezoelectric Impedance-Based Health Monitoring41 topic
  9. Epoxy Resins31 topic
  10. Fiber Networks31 topic
  11. Injection Molding31 topic
  12. Optimization31 topic
  13. Paper Mechanics31 topic
  14. Polybenzoxazines31 topic
  15. 3D Printing21 topic
  16. Additive Manufacturing21 topic

Where does Bjoern Boehme work?

Bjoern Boehme's main affiliation in the publication record is Technische Universität Dresden, Germany.

How many publications and citations does Bjoern Boehme have?

OpenAlex counts 27 works and 188 citations for Bjoern Boehme, an h-index of 8, ranking #6,372,840 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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