Researcher · Amkor Technology (United States) · United States
Boyd Rogers
Boyd Rogers publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Civil and Structural Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and VLSI and FPGA Design Techniques.
- World rank
- #6,844,639 of 7,710,434 ranked researchers
- Rank in United States
- #1,560,958 of 1,627,098
- Works
- 16
- Citations
- 158
- Citations per work
- 9.9
Discussion
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