Che‐Yu Li
Che‐Yu Li publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability and Microstructure and mechanical properties.
- World rank
- #1,183,811 of 7,710,434 ranked researchers
- Rank in United States
- #380,153 of 1,627,098
- Works
- 144
- Citations
- 2.9k
- Citations per work
- 20.0
What does Che‐Yu Li research?
Che‐Yu Li's work is mostly in Engineering (49%), Materials Science (24%), Physics and Astronomy (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences11177.4%
- Engineering7149.4%
- Materials Science3423.9%
- Physics and Astronomy64.1%
- Everything else3322.6%
- 1Electrical and Electronic Engineering21% of their works
- 2Mechanical Engineering18% of their works
- 3Materials Chemistry18% of their works
- 4Mechanics of Materials11% of their works
- 5Electronic, Optical and Magnetic Materials6% of their works
- 6Atomic and Molecular Physics, and Optics4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Copper Interconnects and Reliability
- Microstructure and mechanical properties
- 3D IC and TSV technologies
- Microstructure and Mechanical Properties of Steels
- High Temperature Alloys and Creep
- Metal and Thin Film Mechanics
- High-Velocity Impact and Material Behavior
Which keywords describe Che‐Yu Li's research?
The keywords of their largest research topics: Electromigration, Grain Refinement, Thin Films, Interfacial Reactions, Lead-free Solders, Microstructure, Low-k Dielectrics and Microelectronics.
- High Strain Rate
- Nanoindentation
- Superalloys
- High-Temperature Alloys
- Through-Silicon Via
- Severe Plastic Deformation
- Microelectronics
- Microstructure
- Interfacial Reactions
- Grain Refinement
- Electromigration
- Thin Films
- Lead-free Solders
- Low-k Dielectrics
- Nanocrystalline Materials
- Interconnect
- High-Strength Steels
- Martensite Transformation
- Coatings
- Dynamic Deformation
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 20 words, with their numbers
- Electromigration582 topics
- Grain Refinement362 topics
- Thin Films362 topics
- Interfacial Reactions351 topic
- Lead-free Solders351 topic
- Microstructure282 topics
- Low-k Dielectrics231 topic
- Microelectronics231 topic
- Nanocrystalline Materials221 topic
- Severe Plastic Deformation221 topic
- Interconnect161 topic
- Through-Silicon Via161 topic
- High-Strength Steels141 topic
- High-Temperature Alloys141 topic
- Martensite Transformation141 topic
- Superalloys141 topic
- Coatings131 topic
- Nanoindentation131 topic
- Dynamic Deformation121 topic
- High Strain Rate121 topic
Where does Che‐Yu Li work?
Che‐Yu Li's main affiliation in the publication record is Cornell University, United States.
How many publications and citations does Che‐Yu Li have?
OpenAlex counts 144 works and 2,877 citations for Che‐Yu Li, an h-index of 28, ranking #1,183,811 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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