ChoonHeung Lee
ChoonHeung Lee publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #5,203,418 of 7,710,434 ranked researchers
- Rank in United States
- #1,335,154 of 1,627,098
- Works
- 19
- Citations
- 188
- Citations per work
- 9.9
What does ChoonHeung Lee research?
ChoonHeung Lee's work is mostly in Engineering (81%), Computer Science (5%), Materials Science (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1789.5%
- Engineering1580.7%
- Computer Science15.3%
- Materials Science13.5%
- Everything else210.5%
- 1Electrical and Electronic Engineering72% of their works
- 2Mechanical Engineering5% of their works
- 3Materials Chemistry4% of their works
- 4Automotive Engineering4% of their works
- 5Hardware and Architecture4% of their works
- 6Computer Networks and Communications2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Additive Manufacturing and 3D Printing Technologies
- VLSI and FPGA Design Techniques
- Aluminum Alloys Composites Properties
- Advanced Physical and Chemical Molecular Interactions
- Interconnection Networks and Systems
Which keywords describe ChoonHeung Lee's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Nanoparticles, Interfacial Reactions, Lead-free Solders, Electromagnetic Compatibility, EMI and Power Optimization.
- Networks on Chip
- Interconnection Networks
- Reinforcement
- FPGA
- ASIC
- Power Optimization
- EMI
- Interfacial Reactions
- Through-Silicon Via
- Interconnect
- Nanoparticles
- Lead-free Solders
- Electromagnetic Compatibility
- 3D Printing
- Additive Manufacturing
- Metal Matrix Composites
- Computational Chemistry
- Molecular Simulation
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Interconnect161 topic
- Through-Silicon Via161 topic
- Nanoparticles152 topics
- Interfacial Reactions131 topic
- Lead-free Solders131 topic
- EMI41 topic
- Electromagnetic Compatibility41 topic
- Power Optimization32 topics
- 3D Printing21 topic
- ASIC21 topic
- Additive Manufacturing21 topic
- FPGA21 topic
- Metal Matrix Composites21 topic
- Reinforcement21 topic
- Computational Chemistry11 topic
- Interconnection Networks11 topic
- Molecular Simulation11 topic
- Networks on Chip11 topic
Where does ChoonHeung Lee work?
ChoonHeung Lee's main affiliation in the publication record is Amkor Technology (United States), United States.
How many publications and citations does ChoonHeung Lee have?
OpenAlex counts 19 works and 188 citations for ChoonHeung Lee, an h-index of 7, ranking #5,203,418 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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