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Researcher · Philips (Netherlands) · Netherlands

Clemens J. M. Lasance

Clemens J. M. Lasance publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Heat Transfer and Optimization, Electronic Packaging and Soldering Technologies and Thermal properties of materials.

OpenAlex
World rank
#610,942
of 7,710,434 ranked researchers
Rank in Netherlands
#14,804
of 107,149
Works
107
Citations
2k
Citations per work
18.5
h-index
27
i10-index 40Top 9.5% in Electrical and Electronic Engineering
Clemens J. M. Lasance

What does Clemens J. M. Lasance research?

Clemens J. M. Lasance's work is mostly in Engineering (67%), Materials Science (12%).

Physical Sciences: 85 works · 79.6% of their workEngineering: 72 works · 67.4% of their workElectrical and Electronic Engineering: 32 works · 29.8% of their workMechanical Engineering: 28 works · 25.9% of their workAerospace Engineering: 5 works · 5.1% of their workBiomedical Engineering: 4 works · 3.5% of their workMechanics of Materials: 3 works · 3.1% of their workMaterials Science: 13 works · 12.2% of their workMaterials Chemistry: 13 works · 12.2% of their workEverything else: 22 works · 20.4% of their workTHEIR WORKClemens J. M.Lasance107works
Physical Sciences80%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering7267.4%
    2. Materials Science1312.2%
  2. Everything else2220.4%
  1. 1Electrical and Electronic Engineering30% of their works
  2. 2Mechanical Engineering26% of their works
  3. 3Materials Chemistry12% of their works
  4. 4Aerospace Engineering5% of their works
  5. 5Biomedical Engineering4% of their works
  6. 6Mechanics of Materials3% of their works

Research topics

Which keywords describe Clemens J. M. Lasance's research?

The keywords of their largest research topics: Thermal Management, Heat Transfer, Heat Exchangers, High-Temperature Electronics, Convective Heat Transfer, Microchannel, Interfacial Reactions and Lead-free Solders.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 20 words, with their numbers
  1. Thermal Management964 topics
  2. Heat Transfer583 topics
  3. Heat Exchangers502 topics
  4. High-Temperature Electronics452 topics
  5. Convective Heat Transfer431 topic
  6. Microchannel431 topic
  7. Interfacial Reactions331 topic
  8. Lead-free Solders331 topic
  9. Graphene311 topic
  10. Thermal Conductivity311 topic
  11. Reliability121 topic
  12. Wide Bandgap Semiconductors121 topic
  13. Interconnect101 topic
  14. Through-Silicon Via101 topic
  15. Friction Factor81 topic
  16. Solar Air Heater81 topic
  17. Boiling Heat Transfer71 topic
  18. Microchannels71 topic
  19. Optical Interconnects71 topic
  20. Semiconductor Lasers71 topic

Where does Clemens J. M. Lasance work?

Clemens J. M. Lasance's main affiliation in the publication record is Philips (Netherlands), Netherlands.

How many publications and citations does Clemens J. M. Lasance have?

OpenAlex counts 107 works and 1,978 citations for Clemens J. M. Lasance, an h-index of 27, ranking #610,942 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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