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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Dao-Long Chen

Dao-Long Chen publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Mechanical Behavior of Composites.

ORCID 0000-0001-7856-9457 OpenAlex
World rank
#5,756,127
of 7,710,434 ranked researchers
Rank in Taiwan
#44,490
of 57,035
Works
65
Citations
779
Citations per work
12.0
h-index
14
i10-index 23Top 33% in Electrical and Electronic Engineering
Dao-Long Chen

What does Dao-Long Chen research?

Dao-Long Chen's work is mostly in Engineering (78%), Materials Science (5%).

Physical Sciences: 54 works · 83.4% of their workEngineering: 51 works · 78.2% of their workElectrical and Electronic Engineering: 29 works · 44.3% of their workMechanics of Materials: 11 works · 16.7% of their workMechanical Engineering: 6 works · 8.9% of their workBiomedical Engineering: 3 works · 5.2% of their workCivil and Structural Engineering: 2 works · 3.1% of their workMaterials Science: 3 works · 5.2% of their workMaterials Chemistry: 3 works · 5.2% of their workEverything else: 11 works · 16.6% of their workTHEIR WORKDao-Long Chen65works
Physical Sciences83%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering5178.2%
    2. Materials Science35.2%
  2. Everything else1116.6%
  1. 1Electrical and Electronic Engineering44% of their works
  2. 2Mechanics of Materials17% of their works
  3. 3Mechanical Engineering9% of their works
  4. 4Biomedical Engineering5% of their works
  5. 5Materials Chemistry5% of their works
  6. 6Civil and Structural Engineering3% of their works

Research topics

Which keywords describe Dao-Long Chen's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Cohesive Zone Models, Delamination, Electromagnetic Compatibility and EMI.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 16 words, with their numbers
  1. Interfacial Reactions311 topic
  2. Lead-free Solders311 topic
  3. Interconnect281 topic
  4. Through-Silicon Via281 topic
  5. Cohesive Zone Models81 topic
  6. Delamination81 topic
  7. EMI61 topic
  8. Electromagnetic Compatibility61 topic
  9. Chemical Mechanical Planarization51 topic
  10. Fiber Networks51 topic
  11. Material Removal Mechanism51 topic
  12. Nanoindentation51 topic
  13. Paper Mechanics51 topic
  14. Thin Films51 topic
  15. Biomimetic41 topic
  16. Polymer Films41 topic

Where does Dao-Long Chen work?

Dao-Long Chen's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Dao-Long Chen have?

OpenAlex counts 65 works and 779 citations for Dao-Long Chen, an h-index of 14, ranking #5,756,127 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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