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Researcher · Beijing Microelectronics Technology Institute · China

Daowei Wu

Daowei Wu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.

OpenAlex
World rank
#2,948,224
of 7,710,434 ranked researchers
Rank in China
#463,376
of 978,568
Works
23
Citations
234
Citations per work
10.2
h-index
7
i10-index 6Top 74% in Electrical and Electronic Engineering
Daowei Wu

What does Daowei Wu research?

Daowei Wu's work is mostly in Engineering (81%).

Physical Sciences: 19 works · 80.8% of their workEngineering: 19 works · 80.8% of their workElectrical and Electronic Engineering: 11 works · 47.8% of their workMechanical Engineering: 2 works · 9.0% of their workIndustrial and Manufacturing Engineering: 2 works · 7.5% of their workBiomedical Engineering: 1 works · 6.0% of their workMechanics of Materials: 1 works · 6.0% of their workAerospace Engineering: 1 works · 4.5% of their workEverything else: 4 works · 19.2% of their workTHEIR WORKDaowei Wu23works
Physical Sciences81%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1980.8%
  2. Everything else419.2%
  1. 1Electrical and Electronic Engineering48% of their works
  2. 2Mechanical Engineering9% of their works
  3. 3Industrial and Manufacturing Engineering8% of their works
  4. 4Mechanics of Materials6% of their works
  5. 5Biomedical Engineering6% of their works
  6. 6Aerospace Engineering4% of their works

Research topics

Which keywords describe Daowei Wu's research?

The keywords of their largest research topics: Electromigration, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Assembly Planning.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Electromigration132 topics
  2. Interconnect121 topic
  3. Through-Silicon Via121 topic
  4. Interfacial Reactions111 topic
  5. Lead-free Solders111 topic
  6. 3D Printing31 topic
  7. Additive Manufacturing31 topic
  8. Assembly Planning31 topic
  9. Design for Manufacture31 topic
  10. Chemical Mechanical Planarization21 topic
  11. Fiber Networks21 topic
  12. Low-k Dielectrics21 topic
  13. Material Removal Mechanism21 topic
  14. Microelectronics21 topic
  15. Paper Mechanics21 topic
  16. Cross-modal Plasticity11 topic
  17. Tactile Perception11 topic

Where does Daowei Wu work?

Daowei Wu's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.

How many publications and citations does Daowei Wu have?

OpenAlex counts 23 works and 234 citations for Daowei Wu, an h-index of 7, ranking #2,948,224 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named Daowei Wu

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Discussion

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