Question 1

What does G. Engelmann research?

Accepted Answer

G. Engelmann publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrodeposition and Electroless Coatings.

Question 2

Which keywords describe G. Engelmann's research?

Accepted Answer

The keywords of their largest research topics: Nanoparticles, Thermal Behavior, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Additive Manufacturing and High-Resolution Patterning.

Question 3

Where does G. Engelmann work?

Accepted Answer

G. Engelmann's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.

Question 4

How many publications and citations does G. Engelmann have?

Accepted Answer

OpenAlex counts 26 works and 335 citations for G. Engelmann, an h-index of 10, ranking #4,184,427 of 7,710,434 researchers worldwide on the quality score.

Question 5

Is G. Engelmann's h-index high?

Accepted Answer

An h-index of 10 is at or above that of 53% of the 398,464 ranked researchers whose main subfield is Electrical and Electronic Engineering, which is in the top 52%.