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Researcher · Fraunhofer Institute for Reliability and Microintegration · Germany

G. Engelmann

G. Engelmann publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrodeposition and Electroless Coatings.

OpenAlex
World rank
#4,184,427
of 7,710,434 ranked researchers
Rank in Germany
#211,395
of 364,343
Works
26
Citations
335
Citations per work
12.9
h-index
10
i10-index 13Top 52% in Electrical and Electronic Engineering
G. Engelmann

What does G. Engelmann research?

G. Engelmann's work is mostly in Engineering (77%), Materials Science (4%), Physics and Astronomy (4%).

Physical Sciences: 22 works · 84.9% of their workEngineering: 20 works · 76.7% of their workElectrical and Electronic Engineering: 14 works · 54.8% of their workMechanics of Materials: 3 works · 11.0% of their workBiomedical Engineering: 2 works · 6.8% of their workMechanical Engineering: 1 works · 4.1% of their workMaterials Science: 1 works · 4.1% of their workMaterials Chemistry: 1 works · 4.1% of their workPhysics and Astronomy: 1 works · 4.1% of their workAtomic and Molecular Physics, and Optics: 1 works · 4.1% of their workEverything else: 4 works · 15.1% of their workTHEIR WORKG. Engelmann26works
Physical Sciences85%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2076.7%
    2. Materials Science14.1%
    3. Physics and Astronomy14.1%
  2. Everything else415.1%
  1. 1Electrical and Electronic Engineering55% of their works
  2. 2Mechanics of Materials11% of their works
  3. 3Biomedical Engineering7% of their works
  4. 4Atomic and Molecular Physics, and Optics4% of their works
  5. 5Materials Chemistry4% of their works
  6. 6Mechanical Engineering4% of their works

Research topics

Which keywords describe G. Engelmann's research?

The keywords of their largest research topics: Nanoparticles, Thermal Behavior, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Additive Manufacturing and High-Resolution Patterning.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 20 words, with their numbers
  1. Nanoparticles162 topics
  2. Thermal Behavior152 topics
  3. Interconnect121 topic
  4. Interfacial Reactions121 topic
  5. Lead-free Solders121 topic
  6. Through-Silicon Via121 topic
  7. Additive Manufacturing72 topics
  8. High-Resolution Patterning62 topics
  9. Composite Coatings41 topic
  10. Electrodeposition41 topic
  11. 3D Printing31 topic
  12. Adhesion31 topic
  13. Electron Beam Lithography31 topic
  14. Gecko31 topic
  15. MEMS31 topic
  16. Materials31 topic
  17. Nanofabrication31 topic
  18. Nanolithography31 topic
  19. Silicon31 topic
  20. Soft Lithography31 topic

Where does G. Engelmann work?

G. Engelmann's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.

How many publications and citations does G. Engelmann have?

OpenAlex counts 26 works and 335 citations for G. Engelmann, an h-index of 10, ranking #4,184,427 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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