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Researcher · Industrial Technology Research Institute · Taiwan

Heng-Chieh Chien

Heng-Chieh Chien publishes mostly in Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Thermal properties of materials.

OpenAlex
World rank
#2,910,550
of 7,710,434 ranked researchers
Rank in Taiwan
#19,626
of 57,035
Works
48
Citations
705
Citations per work
14.7
h-index
15
i10-index 21Top 30% in Electrical and Electronic Engineering
Heng-Chieh Chien

What does Heng-Chieh Chien research?

Heng-Chieh Chien's work is mostly in Engineering (69%), Materials Science (15%).

Physical Sciences: 40 works · 84.0% of their workEngineering: 33 works · 68.7% of their workElectrical and Electronic Engineering: 17 works · 36.1% of their workMechanical Engineering: 6 works · 13.2% of their workCivil and Structural Engineering: 4 works · 7.6% of their workAutomotive Engineering: 3 works · 6.9% of their workBiomedical Engineering: 2 works · 4.9% of their workMaterials Science: 7 works · 15.3% of their workMaterials Chemistry: 7 works · 15.3% of their workEverything else: 8 works · 16.0% of their workTHEIR WORKHeng-Chieh Chien48works
Physical Sciences84%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3368.7%
    2. Materials Science715.3%
  2. Everything else816.0%
  1. 1Electrical and Electronic Engineering36% of their works
  2. 2Materials Chemistry15% of their works
  3. 3Mechanical Engineering13% of their works
  4. 4Civil and Structural Engineering8% of their works
  5. 5Automotive Engineering7% of their works
  6. 6Biomedical Engineering5% of their works

Research topics

Which keywords describe Heng-Chieh Chien's research?

The keywords of their largest research topics: Thermal Management, Interconnect, Through-Silicon Via, Polymer Composites, Interfacial Reactions, Lead-free Solders, Materials and Heat Exchangers.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 21 words, with their numbers
  1. Thermal Management463 topics
  2. Interconnect251 topic
  3. Through-Silicon Via251 topic
  4. Polymer Composites232 topics
  5. Interfacial Reactions211 topic
  6. Lead-free Solders211 topic
  7. Materials192 topics
  8. Heat Exchangers162 topics
  9. Heat Transfer162 topics
  10. Graphene131 topic
  11. Thermal Conductivity131 topic
  12. 3D Printing101 topic
  13. Additive Manufacturing101 topic
  14. Daytime Radiative Cooling101 topic
  15. Radiative Cooling101 topic
  16. Performance91 topic
  17. Thermoelectric91 topic
  18. Boiling Heat Transfer81 topic
  19. Convective Heat Transfer81 topic
  20. Microchannel81 topic
  21. Microchannels81 topic

Where does Heng-Chieh Chien work?

Heng-Chieh Chien's main affiliation in the publication record is Industrial Technology Research Institute, Taiwan.

How many publications and citations does Heng-Chieh Chien have?

OpenAlex counts 48 works and 705 citations for Heng-Chieh Chien, an h-index of 15, ranking #2,910,550 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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