Henry Kai-Ming Yang
Henry Kai-Ming Yang publishes mostly in Electrical and Electronic Engineering, Computational Mechanics and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #3,977,789 of 7,710,434 ranked researchers
- Rank in China
- #618,153 of 978,568
- Works
- 22
- Citations
- 544
- Citations per work
- 24.7
What does Henry Kai-Ming Yang research?
Henry Kai-Ming Yang's work is mostly in Engineering (89%), Materials Science (6%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2195.4%
- Engineering2089.4%
- Materials Science16.0%
- Everything else14.6%
- 1Electrical and Electronic Engineering74% of their works
- 2Computational Mechanics6% of their works
- 3Biomedical Engineering6% of their works
- 4Mechanical Engineering3% of their works
- 5Electronic, Optical and Magnetic Materials3% of their works
- 6Surfaces, Coatings and Films3% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced Surface Polishing Techniques
- Nanofabrication and Lithography Techniques
- Surface Roughness and Optical Measurements
- Semiconductor Lasers and Optical Devices
- Modular Robots and Swarm Intelligence
Which keywords describe Henry Kai-Ming Yang's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Electromagnetic Compatibility, EMI, Chemical Mechanical Planarization and Material Removal Mechanism.
- Surface Characterization
- Semiconductor Lasers
- Roughness Measurement
- Nanolithography
- Material Removal Mechanism
- Electromagnetic Compatibility
- Lead-free Solders
- Through-Silicon Via
- Interconnect
- Interfacial Reactions
- EMI
- Chemical Mechanical Planarization
- Modular Robots
- Optical Interconnects
- Self-Reconfiguration
- Soft Lithography
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interconnect161 topic
- Through-Silicon Via161 topic
- Interfacial Reactions151 topic
- Lead-free Solders151 topic
- EMI91 topic
- Electromagnetic Compatibility91 topic
- Chemical Mechanical Planarization21 topic
- Material Removal Mechanism21 topic
- Modular Robots21 topic
- Nanolithography21 topic
- Optical Interconnects21 topic
- Roughness Measurement21 topic
- Self-Reconfiguration21 topic
- Semiconductor Lasers21 topic
- Soft Lithography21 topic
- Surface Characterization21 topic
Where does Henry Kai-Ming Yang work?
Henry Kai-Ming Yang's main affiliation in the publication record is ASM Pacific Technology (China), China.
How many publications and citations does Henry Kai-Ming Yang have?
OpenAlex counts 22 works and 544 citations for Henry Kai-Ming Yang, an h-index of 10, ranking #3,977,789 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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