Hsien‐Chie Cheng
Hsien‐Chie Cheng publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Adhesion, Friction, and Surface Interactions.
- World rank
- #700,075 of 1,633,909 ranked researchers
- Rank in Taiwan
- #3,423 of 9,848
- Works
- 44
- Citations
- 109
- Citations per work
- 2.5
What does Hsien‐Chie Cheng research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering51% of their works
- 2Mechanics of Materials11% of their works
- 3Mechanical Engineering8% of their works
- 4Computational Mechanics5% of their works
- 5Civil and Structural Engineering5% of their works
- 6Materials Chemistry5% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Adhesion, Friction, and Surface Interactions
- Electrostatic Discharge in Electronics
- Advancements in Semiconductor Devices and Circuit Design
- Heat Transfer and Optimization
- Metal and Thin Film Mechanics
- Thermal properties of materials
Which keywords describe Hsien‐Chie Cheng's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via, Adhesion, Gecko and Nanocomposites.
- Tunnel Field-Effect Transistors
- Thermal Conductivity
- Nanoindentation
- Heat Transfer
- ESD Protection
- Nanocomposites
- Adhesion
- Interconnect
- Lead-free Solders
- Interfacial Reactions
- Thermal Management
- Through-Silicon Via
- Gecko
- CMOS Technology
- Graphene
- Microchannel
- Nanowire Transistors
- Thin Films
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Interfacial Reactions131 topic
- Lead-free Solders131 topic
- Thermal Management113 topics
- Interconnect71 topic
- Through-Silicon Via71 topic
- Adhesion41 topic
- Gecko41 topic
- Nanocomposites42 topics
- CMOS Technology21 topic
- ESD Protection21 topic
- Graphene21 topic
- Heat Transfer21 topic
- Microchannel21 topic
- Nanoindentation21 topic
- Nanowire Transistors21 topic
- Thermal Conductivity21 topic
- Thin Films21 topic
- Tunnel Field-Effect Transistors21 topic
Where does Hsien‐Chie Cheng work?
Hsien‐Chie Cheng's main affiliation in the publication record is Feng Chia University, Taiwan.
How many publications and citations does Hsien‐Chie Cheng have?
Science Explorer counts 44 works and 109 citations for Hsien‐Chie Cheng, ranking #700,075 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.