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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Hung-Hsien Huang

Hung-Hsien Huang publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Computational Mechanics, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Heat Transfer and Boiling Studies.

OpenAlex
World rank
#5,283,799
of 7,710,434 ranked researchers
Rank in Taiwan
#40,535
of 57,035
Works
23
Citations
136
Citations per work
5.9
h-index
6
i10-index 4Top 82% in Electrical and Electronic Engineering
Hung-Hsien Huang

What does Hung-Hsien Huang research?

Hung-Hsien Huang's work is mostly in Engineering (78%), Materials Science (6%), Energy (4%).

Physical Sciences: 20 works · 88.2% of their workEngineering: 18 works · 77.9% of their workElectrical and Electronic Engineering: 9 works · 39.7% of their workMechanical Engineering: 6 works · 27.9% of their workComputational Mechanics: 1 works · 5.9% of their workCivil and Structural Engineering: 1 works · 4.4% of their workMaterials Science: 1 works · 5.9% of their workMaterials Chemistry: 1 works · 5.9% of their workEnergy: 1 works · 4.4% of their workRenewable Energy, Sustainability and the Environment: 1 works · 4.4% of their workEverything else: 3 works · 11.8% of their workTHEIR WORKHung-Hsien Huang23works
Physical Sciences88%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1877.9%
    2. Materials Science15.9%
    3. Energy14.4%
  2. Everything else311.8%
  1. 1Electrical and Electronic Engineering40% of their works
  2. 2Mechanical Engineering28% of their works
  3. 3Computational Mechanics6% of their works
  4. 4Materials Chemistry6% of their works
  5. 5Civil and Structural Engineering4% of their works
  6. 6Renewable Energy, Sustainability and the Environment4% of their works

Research topics

Which keywords describe Hung-Hsien Huang's research?

The keywords of their largest research topics: Heat Transfer, Thermal Management, Heat Exchangers, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via and Boiling Heat Transfer.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 19 words, with their numbers
  1. Heat Transfer183 topics
  2. Thermal Management172 topics
  3. Heat Exchangers162 topics
  4. Interfacial Reactions111 topic
  5. Lead-free Solders111 topic
  6. Interconnect101 topic
  7. Through-Silicon Via101 topic
  8. Boiling Heat Transfer91 topic
  9. Microchannels91 topic
  10. Convective Heat Transfer71 topic
  11. Microchannel71 topic
  12. Daytime Radiative Cooling21 topic
  13. Dewetting21 topic
  14. Large-Eddy Simulation21 topic
  15. Photovoltaic/Thermal Hybrid Technology21 topic
  16. Radiative Cooling21 topic
  17. Solar Thermal Collectors21 topic
  18. Thin Films21 topic
  19. Turbulent Flames21 topic

Where does Hung-Hsien Huang work?

Hung-Hsien Huang's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Hung-Hsien Huang have?

OpenAlex counts 23 works and 136 citations for Hung-Hsien Huang, an h-index of 6, ranking #5,283,799 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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