John H. Lau
John H. Lau publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #85,798 of 1,633,909 ranked researchers
- Rank in Taiwan
- #172 of 9,848
- Works
- 114
- Citations
- 475
- Citations per work
- 4.2
What does John H. Lau research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering67% of their works
- 2Mechanics of Materials6% of their works
- 3Mechanical Engineering6% of their works
- 4Civil and Structural Engineering5% of their works
- 5Biomedical Engineering4% of their works
- 6Automotive Engineering4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Additive Manufacturing and 3D Printing Technologies
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Nanofabrication and Lithography Techniques
- Photonic and Optical Devices
- Electromagnetic Compatibility and Noise Suppression
Which keywords describe John H. Lau's research?
The keywords of their largest research topics: Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, 3D Printing, Additive Manufacturing, Atomic Layer Deposition and High-k Dielectrics.
- Electromagnetic Compatibility
- Soft Lithography
- Optical Modulators
- Semiconductor Lasers
- High-k Dielectrics
- Additive Manufacturing
- Through-Silicon Via
- Interfacial Reactions
- Interconnect
- Lead-free Solders
- 3D Printing
- Atomic Layer Deposition
- Optical Interconnects
- Nanolithography
- Silicon Photonics
- EMI
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 16 words, with their numbers
- Interconnect331 topic
- Interfacial Reactions331 topic
- Lead-free Solders331 topic
- Through-Silicon Via331 topic
- 3D Printing51 topic
- Additive Manufacturing51 topic
- Atomic Layer Deposition51 topic
- High-k Dielectrics51 topic
- Optical Interconnects51 topic
- Semiconductor Lasers51 topic
- Nanolithography41 topic
- Optical Modulators41 topic
- Silicon Photonics41 topic
- Soft Lithography41 topic
- EMI31 topic
- Electromagnetic Compatibility31 topic
Where does John H. Lau work?
John H. Lau's main affiliation in the publication record is Nanya Technology (Taiwan), Taiwan.
How many publications and citations does John H. Lau have?
Science Explorer counts 114 works and 475 citations for John H. Lau, ranking #85,798 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.