Researcher · AT&T (United States) · United States
John W. Balde
John W. Balde publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, Material Properties and Processing and 3D IC and TSV technologies.
- World rank
- #5,006,268 of 7,710,434 ranked researchers
- Rank in United States
- #1,298,807 of 1,627,098
- Works
- 21
- Citations
- 207
- Citations per work
- 9.9
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