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Researcher · AT&T (United States) · United States

John W. Balde

John W. Balde publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, Material Properties and Processing and 3D IC and TSV technologies.

OpenAlex
World rank
#5,006,268
of 7,710,434 ranked researchers
Rank in United States
#1,298,807
of 1,627,098
Works
21
Citations
207
Citations per work
9.9
h-index
9
i10-index 8Top 59% in Electrical and Electronic Engineering
John W. Balde

What does John W. Balde research?

John W. Balde's work is mostly in Engineering (72%), Social Sciences (6%).

Physical Sciences: 15 works · 71.5% of their workEngineering: 15 works · 71.5% of their workElectrical and Electronic Engineering: 9 works · 42.9% of their workMechanics of Materials: 3 works · 14.3% of their workBiomedical Engineering: 1 works · 6.1% of their workCivil and Structural Engineering: 1 works · 4.1% of their workMechanical Engineering: 1 works · 4.1% of their workEverything else: 5 works · 22.4% of their workSocial Sciences: 1 works · 6.1% of their workSocial Sciences: 1 works · 6.1% of their workSociology and Political Science: 1 works · 6.1% of their workTHEIR WORKJohn W. Balde21works
Physical Sciences72%Social Sciences6%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1571.5%
  2. Everything else522.4%
    1. Social Sciences16.1%
  1. 1Electrical and Electronic Engineering43% of their works
  2. 2Mechanics of Materials14% of their works
  3. 3Biomedical Engineering6% of their works
  4. 4Sociology and Political Science6% of their works
  5. 5Mechanical Engineering4% of their works
  6. 6Civil and Structural Engineering4% of their works

Research topics

Which keywords describe John W. Balde's research?

The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Fiber Networks, Paper Mechanics, Interconnect, Through-Silicon Via and Corrosion.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 17 words, with their numbers
  1. Nanoparticles102 topics
  2. Interfacial Reactions91 topic
  3. Lead-free Solders91 topic
  4. Fiber Networks71 topic
  5. Paper Mechanics71 topic
  6. Interconnect61 topic
  7. Through-Silicon Via61 topic
  8. Corrosion21 topic
  9. Reinforced Concrete21 topic
  10. 3D Printing11 topic
  11. Additive Manufacturing11 topic
  12. Biodeterioration11 topic
  13. Frequency Selective Surfaces11 topic
  14. Geomycology11 topic
  15. Ice Nucleation11 topic
  16. Melting11 topic
  17. Metasurfaces11 topic

Where does John W. Balde work?

John W. Balde's main affiliation in the publication record is AT&T (United States), United States.

How many publications and citations does John W. Balde have?

OpenAlex counts 21 works and 207 citations for John W. Balde, an h-index of 9, ranking #5,006,268 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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