Kenji Monden
Kenji Monden publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, Composite Material Mechanics and Thermal Analysis in Power Transmission.
- World rank
- #6,555,393 of 7,710,434 ranked researchers
- Rank in Japan
- #267,229 of 383,136
- Works
- 26
- Citations
- 101
- Citations per work
- 3.9
What does Kenji Monden research?
Kenji Monden's work is mostly in Engineering (58%), Materials Science (13%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1871.1%
- Engineering1558.2%
- Materials Science312.9%
- Everything else828.9%
- 1Electrical and Electronic Engineering19% of their works
- 2Biomedical Engineering13% of their works
- 3Materials Chemistry13% of their works
- 4Mechanical Engineering10% of their works
- 5Mechanics of Materials8% of their works
- 6Control and Systems Engineering8% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Composite Material Mechanics
- Thermal Analysis in Power Transmission
- 3D IC and TSV technologies
- High voltage insulation and dielectric phenomena
- Aerogels and thermal insulation
- Microfluidic and Capillary Electrophoresis Applications
- Silicon Carbide Semiconductor Technologies
Which keywords describe Kenji Monden's research?
The keywords of their largest research topics: High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Nanocomposites, Thermal Management, Heterogeneous Materials, Multi-Scale and Dielectrics.
- Synthesis
- Poly(dimethylsiloxane)
- Aerogels
- Thermal Analysis
- Interconnect
- Dielectrics
- Heterogeneous Materials
- Nanocomposites
- Interfacial Reactions
- High-Temperature Electronics
- Lead-free Solders
- Thermal Management
- Multi-Scale
- Dynamic Line Rating
- Polymer
- Through-Silicon Via
- Lab-on-a-Chip
- Reliability
- Wide Bandgap Semiconductors
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- High-Temperature Electronics72 topics
- Interfacial Reactions51 topic
- Lead-free Solders51 topic
- Nanocomposites52 topics
- Thermal Management52 topics
- Heterogeneous Materials41 topic
- Multi-Scale41 topic
- Dielectrics31 topic
- Dynamic Line Rating31 topic
- Interconnect31 topic
- Polymer31 topic
- Thermal Analysis31 topic
- Through-Silicon Via31 topic
- Aerogels21 topic
- Lab-on-a-Chip21 topic
- Poly(dimethylsiloxane)21 topic
- Reliability21 topic
- Synthesis21 topic
- Wide Bandgap Semiconductors21 topic
Where does Kenji Monden work?
Kenji Monden's main affiliation in the publication record is Denka (Japan), Japan.
How many publications and citations does Kenji Monden have?
OpenAlex counts 26 works and 101 citations for Kenji Monden, an h-index of 5, ranking #6,555,393 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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