Kuldip Johal
Kuldip Johal publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and General Materials Science, on topics such as Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability and Electrodeposition and Electroless Coatings.
- World rank
- #5,607,243 of 7,710,434 ranked researchers
- Rank in United States
- #1,403,274 of 1,627,098
- Works
- 18
- Citations
- 355
- Citations per work
- 19.7
What does Kuldip Johal research?
Kuldip Johal's work is mostly in Engineering (63%), Materials Science (26%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1689.0%
- Engineering1163.0%
- Materials Science526.0%
- Everything else211.0%
- 1Electrical and Electronic Engineering54% of their works
- 2Electronic, Optical and Magnetic Materials13% of their works
- 3General Materials Science9% of their works
- 4Mechanical Engineering6% of their works
- 5Civil and Structural Engineering4% of their works
- 6Materials Chemistry4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Copper Interconnects and Reliability
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
- Metallurgical and Alloy Processes
- Advanced Welding Techniques Analysis
- Electrochemical Analysis and Applications
- Additive Manufacturing and 3D Printing Technologies
Which keywords describe Kuldip Johal's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Thin Films, Additive Manufacturing, Low-k Dielectrics and Mechanical Properties.
- Materials
- Detection
- Processing
- Phase Diagrams
- Through-Silicon Via
- Electrodeposition
- Microstructure
- Mechanical Properties
- Additive Manufacturing
- Lead-free Solders
- Nanoparticles
- Electromigration
- Interfacial Reactions
- Thin Films
- Low-k Dielectrics
- Microelectronics
- Composite Coatings
- Interconnect
- Alloys
- Friction Stir Welding
- 3D Printing
- Electrochemical
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 22 words, with their numbers
- Electromigration212 topics
- Nanoparticles202 topics
- Interfacial Reactions141 topic
- Lead-free Solders141 topic
- Thin Films122 topics
- Additive Manufacturing72 topics
- Low-k Dielectrics71 topic
- Mechanical Properties72 topics
- Microelectronics71 topic
- Microstructure72 topics
- Composite Coatings61 topic
- Electrodeposition61 topic
- Interconnect61 topic
- Through-Silicon Via61 topic
- Alloys51 topic
- Phase Diagrams51 topic
- Friction Stir Welding21 topic
- Processing21 topic
- 3D Printing11 topic
- Detection11 topic
- Electrochemical11 topic
- Materials11 topic
Where does Kuldip Johal work?
Kuldip Johal's main affiliation in the publication record is Atotech (United States), United States.
How many publications and citations does Kuldip Johal have?
OpenAlex counts 18 works and 355 citations for Kuldip Johal, an h-index of 4, ranking #5,607,243 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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