Kwang‐Lung Lin
Kwang‐Lung Lin publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Copper Interconnects and Reliability.
- World rank
- #303,130 of 1,633,909 ranked researchers
- Rank in Taiwan
- #1,126 of 9,848
- Works
- 54
- Citations
- 182
- Citations per work
- 3.4
What does Kwang‐Lung Lin research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering46% of their works
- 2Mechanical Engineering12% of their works
- 3Electronic, Optical and Magnetic Materials9% of their works
- 4Materials Chemistry9% of their works
- 5Atomic and Molecular Physics, and Optics6% of their works
- 6General Materials Science3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Electromagnetic Effects on Materials
- Semiconductor materials and interfaces
- Electrodeposition and Electroless Coatings
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
Which keywords describe Kwang‐Lung Lin's research?
The keywords of their largest research topics: Electromigration, Thermal Behavior, Nanoparticles, Interfacial Reactions, Lead-free Solders, Mechanical Properties, Interconnect and Through-Silicon Via.
- Processing
- Friction Stir Welding
- Composite Coatings
- Metal-Semiconductor Contacts
- Electrically-Assisted Deformation
- Low-k Dielectrics
- Through-Silicon Via
- Mechanical Properties
- Interfacial Reactions
- Thermal Behavior
- Electromigration
- Nanoparticles
- Lead-free Solders
- Interconnect
- Microstructure
- Microelectronics
- Electropulsing
- Schottky Barrier
- Electrodeposition
- Intermetallic Alloys
- TiAl Alloys
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 21 words, with their numbers
- Electromigration182 topics
- Thermal Behavior172 topics
- Nanoparticles162 topics
- Interfacial Reactions131 topic
- Lead-free Solders131 topic
- Mechanical Properties103 topics
- Interconnect81 topic
- Through-Silicon Via81 topic
- Microstructure62 topics
- Low-k Dielectrics51 topic
- Microelectronics51 topic
- Electrically-Assisted Deformation41 topic
- Electropulsing41 topic
- Metal-Semiconductor Contacts41 topic
- Schottky Barrier41 topic
- Composite Coatings31 topic
- Electrodeposition31 topic
- Friction Stir Welding31 topic
- Intermetallic Alloys31 topic
- Processing31 topic
- TiAl Alloys31 topic
Where does Kwang‐Lung Lin work?
Kwang‐Lung Lin's main affiliation in the publication record is National Cheng Kung University, Taiwan.
How many publications and citations does Kwang‐Lung Lin have?
Science Explorer counts 54 works and 182 citations for Kwang‐Lung Lin, ranking #303,130 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.