Mike Morianz
Mike Morianz publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Silicon Carbide Semiconductor Technologies, Electronic Packaging and Soldering Technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #5,673,916 of 7,710,434 ranked researchers
- Rank in Austria
- #34,904 of 43,330
- Works
- 19
- Citations
- 118
- Citations per work
- 6.2
What does Mike Morianz research?
Mike Morianz's work is mostly in Engineering (96%), Environmental Science (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1998.3%
- Engineering1896.5%
- Environmental Science01.8%
- 1Electrical and Electronic Engineering81% of their works
- 2Mechanical Engineering7% of their works
- 3Mechanics of Materials4% of their works
- 4Automotive Engineering4% of their works
- 5Biomedical Engineering2% of their works
- 6Industrial and Manufacturing Engineering2% of their works
Research topics
- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Advanced DC-DC Converters
- Advanced Battery Technologies Research
- Metal Forming Simulation Techniques
- Advanced Surface Polishing Techniques
Which keywords describe Mike Morianz's research?
The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Power Electronics, Interfacial Reactions, Lead-free Solders, Reliability, Wide Bandgap Semiconductors and Electromagnetic Compatibility.
- Chemical Mechanical Planarization
- Lithium-ion Batteries
- Battery Management Systems
- DC-DC Converters
- Interconnect
- EMI
- Reliability
- Interfacial Reactions
- Thermal Management
- High-Temperature Electronics
- Power Electronics
- Lead-free Solders
- Wide Bandgap Semiconductors
- Electromagnetic Compatibility
- Through-Silicon Via
- High-Frequency Power Conversion
- Ductile Fracture
- Sheet Metal Forming
- Material Removal Mechanism
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- High-Temperature Electronics202 topics
- Thermal Management193 topics
- Power Electronics132 topics
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- Reliability101 topic
- Wide Bandgap Semiconductors101 topic
- EMI91 topic
- Electromagnetic Compatibility91 topic
- Interconnect71 topic
- Through-Silicon Via71 topic
- DC-DC Converters41 topic
- High-Frequency Power Conversion41 topic
- Battery Management Systems21 topic
- Ductile Fracture21 topic
- Lithium-ion Batteries21 topic
- Sheet Metal Forming21 topic
- Chemical Mechanical Planarization11 topic
- Material Removal Mechanism11 topic
Where does Mike Morianz work?
Mike Morianz's main affiliation in the publication record is AT&S (Austria), Austria.
How many publications and citations does Mike Morianz have?
OpenAlex counts 19 works and 118 citations for Mike Morianz, an h-index of 6, ranking #5,673,916 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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