Ning-Cheng Lee
Ning-Cheng Lee publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Metallurgical and Alloy Processes.
- World rank
- #1,271,181 of 1,633,909 ranked researchers
- Rank in United States
- #306,604 of 358,040
- Works
- 41
- Citations
- 33
- Citations per work
- 0.8
What does Ning-Cheng Lee research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering56% of their works
- 2Mechanical Engineering14% of their works
- 3General Materials Science14% of their works
- 4Mechanics of Materials4% of their works
- 5Electronic, Optical and Magnetic Materials4% of their works
- 6Materials Chemistry4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Metallurgical and Alloy Processes
- Nanomaterials and Printing Technologies
- Intermetallics and Advanced Alloy Properties
- Electrodeposition and Electroless Coatings
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
Which keywords describe Ning-Cheng Lee's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interfacial Reactions, Lead-free Solders, Mechanical Properties, Microstructure, Thin Films and Alloys.
- Chemical Mechanical Planarization
- Low-k Dielectrics
- Composite Coatings
- Intermetallic Alloys
- Inkjet Printing
- Phase Diagrams
- Alloys
- Microstructure
- Lead-free Solders
- Nanoparticles
- Electromigration
- Interfacial Reactions
- Mechanical Properties
- Thin Films
- Interconnect
- Through-Silicon Via
- Transparent Electrodes
- TiAl Alloys
- Electrodeposition
- Microelectronics
- Material Removal Mechanism
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 21 words, with their numbers
- Electromigration182 topics
- Nanoparticles182 topics
- Interfacial Reactions161 topic
- Lead-free Solders161 topic
- Mechanical Properties112 topics
- Microstructure112 topics
- Thin Films102 topics
- Alloys81 topic
- Interconnect81 topic
- Phase Diagrams81 topic
- Through-Silicon Via81 topic
- Inkjet Printing41 topic
- Transparent Electrodes41 topic
- Intermetallic Alloys31 topic
- TiAl Alloys31 topic
- Composite Coatings21 topic
- Electrodeposition21 topic
- Low-k Dielectrics21 topic
- Microelectronics21 topic
- Chemical Mechanical Planarization11 topic
- Material Removal Mechanism11 topic
Where does Ning-Cheng Lee work?
Ning-Cheng Lee's main affiliation in the publication record is Indium Corporation (United States), United States.
How many publications and citations does Ning-Cheng Lee have?
Science Explorer counts 41 works and 33 citations for Ning-Cheng Lee, ranking #1,271,181 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.