Indium Corporation (United States)

The fields where it stands highest, 2022–2025, ranked among every institution above the floor in each field.

Each strip is that field’s whole ranked pool, with the notch where Indium Corporation (United States) sits in it, in the colour of the band that rank falls in. The track under the rate is the rate itself: it carries no world mark, because the world rate differs by field (from about 6% to 21% in this record).

Where its research is concentrated relative to its size: Electrical and Electronic Engineering takes 16.0× the share of its output that it takes of world research.

1. Electrical and Electronic EngineeringSubfield · 41.6 works16×
2. EngineeringField · 55.8 works5.1×

Location quotient, a volume reading rather than an impact one. It surfaces small, lopsided specialities.

Location quotient across every field it publishes in: outside the ring is more than an institution of this size would be expected to publish, inside it is less.

• Engineering 5.1×
• Materials Science 3.4×
• Decision Sciences 1.2×
• Mathematics 1.2×
• Chemistry 0.7×
• Computer Science 0.4×
• Business, Management and Accounting 0.4×
• Environmental Science 0.3×
• Energy 0.3×
• Physics and Astronomy 0.2×
• Earth and Planetary Sciences 0.1×
• Agricultural and Biological Sciences 0.0×
• Psychology 0.0×
• Social Sciences 0.0×
• Biochemistry, Genetics and Molecular Biology 0.0×

Ranked on the composite score, Ning-Cheng Lee lead among researchers whose main affiliation is Indium Corporation (United States).

1. 1 🇺🇸 Ning-Cheng Lee United States · #1,271,181 worldwide 33 citations · 41 works

By fractional works in 2022–2025, weighted toward what it does more of than the world: Electromigration, Nanoparticles, High-Temperature Electronics, Rare Earth Elements, Interfacial Reactions, Lead-free Solders, Thermal Management and Interconnect.

By volume in 2022–2025: Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Nanomaterials and Printing Technologies and Metallurgical and Alloy Processes.

1. 1 Electronic Packaging and Soldering Technologies Electrical and Electronic Engineering 20 works
2. 2 3D IC and TSV technologies Electrical and Electronic Engineering 13 works
3. 3 Nanomaterials and Printing Technologies Electrical and Electronic Engineering 6 works
4. 4 Metallurgical and Alloy Processes General Materials Science 3 works
5. 5 Manufacturing Process and Optimization Industrial and Manufacturing Engineering 2 works
6. 6 Thermal properties of materials Materials Chemistry 2 works
7. 7 Advanced Welding Techniques Analysis Mechanical Engineering 2 works
8. 8 Copper Interconnects and Reliability Electronic, Optical and Magnetic Materials 2 works
9. 9 Electrical Contact Performance and Analysis Mechanical Engineering 1 works
10. 10 VLSI and Analog Circuit Testing Hardware and Architecture 1 works

Against the world’s own shares — the tick on each track. Both are shares of its output, so they sit on one scale and can be read against each other as well as against the world.

Output in 2018–2022 was 31% lower than in 2013–2017.

• Hamilton College