R. Dudek
R. Dudek publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Mechanical Behavior of Composites.
- World rank
- #1,126,111 of 1,633,909 ranked researchers
- Rank in Germany
- #64,596 of 86,443
- Works
- 33
- Citations
- 56
- Citations per work
- 1.7
What does R. Dudek research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering62% of their works
- 2Mechanics of Materials22% of their works
- 3Mechanical Engineering9% of their works
- 4Materials Chemistry4% of their works
- 5Media Technology2% of their works
- 6Biomedical Engineering2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Behavior of Composites
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Noise Suppression
- Aluminum Alloys Composites Properties
- Fatigue and fracture mechanics
Which keywords describe R. Dudek's research?
The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Cohesive Zone Models, Delamination and Failure Analysis.
- Metal Matrix Composites
- Fatigue Crack Closure
- ESD Protection
- CMOS Technology
- Failure Analysis
- Cohesive Zone Models
- Interconnect
- Interfacial Reactions
- Nanoparticles
- Lead-free Solders
- Through-Silicon Via
- Delamination
- Integrated Circuits
- EMI
- Electromagnetic Compatibility
- Fracture Toughness Testing
- Reinforcement
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Nanoparticles192 topics
- Interfacial Reactions171 topic
- Lead-free Solders171 topic
- Interconnect91 topic
- Through-Silicon Via91 topic
- Cohesive Zone Models41 topic
- Delamination41 topic
- Failure Analysis31 topic
- Integrated Circuits31 topic
- CMOS Technology21 topic
- EMI21 topic
- ESD Protection21 topic
- Electromagnetic Compatibility21 topic
- Fatigue Crack Closure21 topic
- Fracture Toughness Testing21 topic
- Metal Matrix Composites21 topic
- Reinforcement21 topic
Where does R. Dudek work?
R. Dudek's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.
How many publications and citations does R. Dudek have?
Science Explorer counts 33 works and 56 citations for R. Dudek, ranking #1,126,111 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.