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Researcher · Amkor Technology (United States) · United States

Robert Darveaux

Robert Darveaux publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.

OpenAlex
World rank
#1,054,693
of 7,710,434 ranked researchers
Rank in United States
#342,632
of 1,627,098
Works
73
Citations
2.7k
Citations per work
36.9
h-index
21
i10-index 33Top 16% in Electrical and Electronic Engineering
Robert Darveaux

What does Robert Darveaux research?

Robert Darveaux's work is mostly in Engineering (82%), Materials Science (6%).

Physical Sciences: 64 works · 88.0% of their workEngineering: 60 works · 82.3% of their workElectrical and Electronic Engineering: 46 works · 63.2% of their workMechanical Engineering: 9 works · 12.0% of their workAerospace Engineering: 3 works · 3.8% of their workMechanics of Materials: 2 works · 3.3% of their workMaterials Science: 4 works · 5.7% of their workGeneral Materials Science: 2 works · 3.3% of their workMaterials Chemistry: 2 works · 2.4% of their workEverything else: 9 works · 12.0% of their workTHEIR WORKRobert Darveaux73works
Physical Sciences88%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering6082.3%
    2. Materials Science45.7%
  2. Everything else912.0%
  1. 1Electrical and Electronic Engineering63% of their works
  2. 2Mechanical Engineering12% of their works
  3. 3Aerospace Engineering4% of their works
  4. 4Mechanics of Materials3% of their works
  5. 5General Materials Science3% of their works
  6. 6Materials Chemistry2% of their works

Research topics

Which keywords describe Robert Darveaux's research?

The keywords of their largest research topics: High-Temperature Electronics, Nanoparticles, Interfacial Reactions, Lead-free Solders, Thermal Management, Interconnect, Through-Silicon Via and Electromagnetic Compatibility.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 21 words, with their numbers
  1. High-Temperature Electronics662 topics
  2. Nanoparticles652 topics
  3. Interfacial Reactions611 topic
  4. Lead-free Solders611 topic
  5. Thermal Management452 topics
  6. Interconnect401 topic
  7. Through-Silicon Via401 topic
  8. EMI101 topic
  9. Electromagnetic Compatibility101 topic
  10. Mechanical Properties102 topics
  11. Microstructure102 topics
  12. Alloys61 topic
  13. Phase Diagrams61 topic
  14. CMOS Image Sensors51 topic
  15. High-Speed Imaging51 topic
  16. Reliability51 topic
  17. Wide Bandgap Semiconductors51 topic
  18. Ductile Fracture41 topic
  19. Metal Matrix Composites41 topic
  20. Reinforcement41 topic
  21. Sheet Metal Forming41 topic

Where does Robert Darveaux work?

Robert Darveaux's main affiliation in the publication record is Amkor Technology (United States), United States.

How many publications and citations does Robert Darveaux have?

OpenAlex counts 73 works and 2,693 citations for Robert Darveaux, an h-index of 21, ranking #1,054,693 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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