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Researcher · Fraunhofer Institute for Reliability and Microintegration · Germany

Simon Maus

Simon Maus publishes mostly in Electrical and Electronic Engineering, Computational Mechanics and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Semiconductor Lasers and Optical Devices.

OpenAlex
World rank
#6,442,502
of 7,710,434 ranked researchers
Rank in Germany
#324,748
of 364,343
Works
19
Citations
49
Citations per work
2.6
h-index
4
i10-index 1Top 94% in Electrical and Electronic Engineering
Simon Maus

What does Simon Maus research?

Simon Maus's work is mostly in Engineering (93%), Materials Science (4%).

Physical Sciences: 18 works · 96.5% of their workEngineering: 18 works · 92.8% of their workElectrical and Electronic Engineering: 14 works · 74.1% of their workComputational Mechanics: 2 works · 9.3% of their workBiomedical Engineering: 1 works · 5.6% of their workAerospace Engineering: 0 works · 1.9% of their workCivil and Structural Engineering: 0 works · 1.9% of their workMaterials Science: 1 works · 3.7% of their workMaterials Chemistry: 1 works · 3.7% of their workEverything else: 1 works · 3.5% of their workTHEIR WORKSimon Maus19works
Physical Sciences96%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1892.8%
    2. Materials Science13.7%
  2. Everything else13.5%
  1. 1Electrical and Electronic Engineering74% of their works
  2. 2Computational Mechanics9% of their works
  3. 3Biomedical Engineering6% of their works
  4. 4Materials Chemistry4% of their works
  5. 5Civil and Structural Engineering2% of their works
  6. 6Aerospace Engineering2% of their works

Research topics

Which keywords describe Simon Maus's research?

The keywords of their largest research topics: Thermal Behavior, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Optical Interconnects, Semiconductor Lasers and MEMS.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 17 words, with their numbers
  1. Thermal Behavior132 topics
  2. Interconnect121 topic
  3. Through-Silicon Via121 topic
  4. Interfacial Reactions91 topic
  5. Lead-free Solders91 topic
  6. Optical Interconnects61 topic
  7. Semiconductor Lasers61 topic
  8. MEMS41 topic
  9. Roughness Measurement41 topic
  10. Silicon41 topic
  11. Surface Characterization41 topic
  12. Plasmonics31 topic
  13. Thin-Film Transistors31 topic
  14. Atomic Layer Deposition21 topic
  15. High-k Dielectrics21 topic
  16. Gas Turbine Engines11 topic
  17. Thermal Barrier Coatings11 topic

Where does Simon Maus work?

Simon Maus's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.

How many publications and citations does Simon Maus have?

OpenAlex counts 19 works and 49 citations for Simon Maus, an h-index of 4, ranking #6,442,502 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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