Science Explorer Back to mapMap
Discussion
Researcher · EV Group (Austria) · Austria

Thomas Plach

Thomas Plach publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Advanced Surface Polishing Techniques.

OpenAlex
World rank
#5,488,603
of 7,710,434 ranked researchers
Rank in Austria
#33,814
of 43,330
Works
38
Citations
419
Citations per work
11.0
h-index
9
i10-index 9Top 59% in Electrical and Electronic Engineering
Thomas Plach

What does Thomas Plach research?

Thomas Plach's work is mostly in Engineering (79%), Materials Science (10%).

Physical Sciences: 34 works · 88.4% of their workEngineering: 30 works · 78.7% of their workElectrical and Electronic Engineering: 21 works · 56.3% of their workBiomedical Engineering: 4 works · 10.7% of their workAutomotive Engineering: 1 works · 3.9% of their workMechanical Engineering: 1 works · 3.9% of their workMechanics of Materials: 1 works · 3.9% of their workMaterials Science: 4 works · 9.7% of their workElectronic, Optical and Magnetic Materials: 4 works · 9.7% of their workEverything else: 4 works · 11.6% of their workTHEIR WORKThomas Plach38works
Physical Sciences88%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3078.7%
    2. Materials Science49.7%
  2. Everything else411.6%
  1. 1Electrical and Electronic Engineering56% of their works
  2. 2Biomedical Engineering11% of their works
  3. 3Electronic, Optical and Magnetic Materials10% of their works
  4. 4Automotive Engineering4% of their works
  5. 5Mechanics of Materials4% of their works
  6. 6Mechanical Engineering4% of their works

Research topics

Which keywords describe Thomas Plach's research?

The keywords of their largest research topics: Electromigration, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Chemical Mechanical Planarization, Low-k Dielectrics and Material Removal Mechanism.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. Electromigration282 topics
  2. Interconnect271 topic
  3. Through-Silicon Via271 topic
  4. Interfacial Reactions201 topic
  5. Lead-free Solders201 topic
  6. Chemical Mechanical Planarization81 topic
  7. Low-k Dielectrics81 topic
  8. Material Removal Mechanism81 topic
  9. Microelectronics81 topic
  10. Solar Cells52 topics
  11. 3D Printing41 topic
  12. Additive Manufacturing41 topic
  13. Atomic Layer Deposition31 topic
  14. Efficiency31 topic
  15. High-k Dielectrics31 topic
  16. Silicon31 topic
  17. Nanosensors21 topic
  18. Nanowire21 topic

Where does Thomas Plach work?

Thomas Plach's main affiliation in the publication record is EV Group (Austria), Austria.

How many publications and citations does Thomas Plach have?

OpenAlex counts 38 works and 419 citations for Thomas Plach, an h-index of 9, ranking #5,488,603 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

Ask a question or share a note about Thomas Plach. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.