Tzu-Kun Ku
Tzu-Kun Ku publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Semiconductor materials and devices.
- World rank
- #411,784 of 1,633,909 ranked researchers
- Rank in Taiwan
- #1,669 of 9,848
- Works
- 21
- Citations
- 92
- Citations per work
- 4.4
What does Tzu-Kun Ku research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering67% of their works
- 2Biomedical Engineering8% of their works
- 3Materials Chemistry8% of their works
- 4Automotive Engineering4% of their works
- 5Hardware and Architecture4% of their works
- 6Atomic and Molecular Physics, and Optics4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
- Caching and Content Delivery
- Network Packet Processing and Optimization
- Additive Manufacturing and 3D Printing Technologies
Which keywords describe Tzu-Kun Ku's research?
The keywords of their largest research topics: Interconnect, Interfacial Reactions, Lead-free Solders, Neuromorphic Computing, Through-Silicon Via, Atomic Layer Deposition, High-k Dielectrics and Ferroelectricity.
- Information-Centric Networking
- Caching
- 3D Printing
- Memristor
- Ferroelectricity
- Atomic Layer Deposition
- Neuromorphic Computing
- Interfacial Reactions
- Interconnect
- Lead-free Solders
- Through-Silicon Via
- High-k Dielectrics
- Hafnium Oxide
- Resistive Switching
- Additive Manufacturing
- Deep Packet Inspection
- Packet Classification
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Interconnect41 topic
- Interfacial Reactions41 topic
- Lead-free Solders41 topic
- Neuromorphic Computing42 topics
- Through-Silicon Via41 topic
- Atomic Layer Deposition31 topic
- High-k Dielectrics31 topic
- Ferroelectricity21 topic
- Hafnium Oxide21 topic
- Memristor21 topic
- Resistive Switching21 topic
- 3D Printing11 topic
- Additive Manufacturing11 topic
- Caching11 topic
- Deep Packet Inspection11 topic
- Information-Centric Networking11 topic
- Packet Classification11 topic
Where does Tzu-Kun Ku work?
Tzu-Kun Ku's main affiliation in the publication record is Industrial Technology Research Institute, Taiwan.
How many publications and citations does Tzu-Kun Ku have?
Science Explorer counts 21 works and 92 citations for Tzu-Kun Ku, ranking #411,784 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.