Yingzhuo Huang
Yingzhuo Huang publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Computer Vision and Pattern Recognition, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Welding Techniques Analysis.
- World rank
- #5,885,888 of 7,710,434 ranked researchers
- Rank in China
- #838,422 of 978,568
- Works
- 21
- Citations
- 100
- Citations per work
- 4.8
What does Yingzhuo Huang research?
Yingzhuo Huang's work is mostly in Engineering (75%), Computer Science (7%), Biochemistry, Genetics and Molecular Biology (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1884.9%
- Engineering1675.0%
- Computer Science16.6%
- Materials Science13.3%
- Everything else211.8%
- Life Sciences13.3%
- 1Electrical and Electronic Engineering62% of their works
- 2Mechanical Engineering13% of their works
- 3Computer Vision and Pattern Recognition3% of their works
- 4Ceramics and Composites3% of their works
- 5Artificial Intelligence3% of their works
- 6Molecular Biology3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Welding Techniques Analysis
- Electromagnetic Compatibility and Noise Suppression
- Electrical Contact Performance and Analysis
- Advanced ceramic materials synthesis
- Biomedical Text Mining and Ontologies
- Glycosylation and Glycoproteins Research
Which keywords describe Yingzhuo Huang's research?
The keywords of their largest research topics: Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Friction Stir Welding, Processing, Ceramic Materials and Electrical Contact Materials.
- Text Mining
- Glycans
- Sintering
- Electromagnetic Compatibility
- EMI
- Processing
- Through-Silicon Via
- Interfacial Reactions
- Interconnect
- Lead-free Solders
- Friction Stir Welding
- Ceramic Materials
- Electrical Contact Materials
- Pantograph-Catenary Interaction
- Biomedical Ontologies
- Glycosylation
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interconnect151 topic
- Interfacial Reactions151 topic
- Lead-free Solders151 topic
- Through-Silicon Via151 topic
- Friction Stir Welding41 topic
- Processing41 topic
- Ceramic Materials21 topic
- EMI21 topic
- Electrical Contact Materials21 topic
- Electromagnetic Compatibility21 topic
- Pantograph-Catenary Interaction21 topic
- Sintering21 topic
- Biomedical Ontologies11 topic
- Glycans11 topic
- Glycosylation11 topic
- Text Mining11 topic
Where does Yingzhuo Huang work?
Yingzhuo Huang's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.
How many publications and citations does Yingzhuo Huang have?
OpenAlex counts 21 works and 100 citations for Yingzhuo Huang, an h-index of 4, ranking #5,885,888 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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