Arianna Morelli
Arianna Morelli publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, on topics such as Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies and 3D IC and TSV technologies.
- World rank
- #4,460,437 of 7,710,434 ranked researchers
- Rank in Italy
- #150,840 of 242,206
- Works
- 17
- Citations
- 210
- Citations per work
- 12.4
What does Arianna Morelli research?
Arianna Morelli's work is mostly in Engineering (78%), Materials Science (6%), Social Sciences (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1585.7%
- Engineering1377.6%
- Materials Science16.1%
- Environmental Science02.0%
- Everything else210.2%
- Social Sciences14.1%
- Social Sciences14.1%
- 1Electrical and Electronic Engineering65% of their works
- 2Mechanical Engineering8% of their works
- 3Electronic, Optical and Magnetic Materials6% of their works
- 4Civil and Structural Engineering4% of their works
- 5Sociology and Political Science4% of their works
- 6Global and Planetary Change2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Heat Transfer and Optimization
- Magnetic Properties and Applications
- Infrastructure Resilience and Vulnerability Analysis
Which keywords describe Arianna Morelli's research?
The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Interfacial Reactions, Lead-free Solders, Interconnect, Reliability, Through-Silicon Via and Wide Bandgap Semiconductors.
- Interdependent Systems
- Microchannel
- Magnetic Materials
- ESD Protection
- Electromagnetic Compatibility
- Wide Bandgap Semiconductors
- Reliability
- Lead-free Solders
- Thermal Management
- High-Temperature Electronics
- Interfacial Reactions
- Interconnect
- Through-Silicon Via
- EMI
- CMOS Technology
- Heat Transfer
- Magnetostriction
- Infrastructure Resilience
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- High-Temperature Electronics162 topics
- Thermal Management153 topics
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- Interconnect61 topic
- Reliability61 topic
- Through-Silicon Via61 topic
- Wide Bandgap Semiconductors61 topic
- EMI51 topic
- Electromagnetic Compatibility51 topic
- CMOS Technology41 topic
- ESD Protection41 topic
- Heat Transfer31 topic
- Magnetic Materials31 topic
- Magnetostriction31 topic
- Microchannel31 topic
- Infrastructure Resilience21 topic
- Interdependent Systems21 topic
Where does Arianna Morelli work?
Arianna Morelli's main affiliation in the publication record is STMicroelectronics (Italy), Italy.
How many publications and citations does Arianna Morelli have?
OpenAlex counts 17 works and 210 citations for Arianna Morelli, an h-index of 7, ranking #4,460,437 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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