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Researcher · Aptiv (United States) · United States

Arvind Krishna

Arvind Krishna publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Mechanical Behavior of Composites.

ORCID 0009-0005-2308-2111 OpenAlex
World rank
#5,987,804
of 7,710,434 ranked researchers
Rank in United States
#1,460,177
of 1,627,098
Works
24
Citations
66
Citations per work
2.8
h-index
4
i10-index 2Top 94% in Electrical and Electronic Engineering
Arvind Krishna

What does Arvind Krishna research?

Arvind Krishna's work is mostly in Engineering (68%), Materials Science (6%), Medicine (3%).

Physical Sciences: 18 works · 73.9% of their workEngineering: 16 works · 67.7% of their workElectrical and Electronic Engineering: 8 works · 35.4% of their workMechanics of Materials: 3 works · 12.3% of their workMechanical Engineering: 3 works · 10.8% of their workCivil and Structural Engineering: 2 works · 9.2% of their workMaterials Science: 1 works · 6.2% of their workPolymers and Plastics: 1 works · 6.2% of their workEverything else: 6 works · 23.0% of their workHealth Sciences: 1 works · 3.1% of their workMedicine: 1 works · 3.1% of their workDermatology: 1 works · 3.1% of their workTHEIR WORKArvind Krishna24works
Physical Sciences74%Health Sciences3%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1667.7%
    2. Materials Science16.2%
  2. Everything else623.0%
    1. Medicine13.1%
  1. 1Electrical and Electronic Engineering35% of their works
  2. 2Mechanics of Materials12% of their works
  3. 3Mechanical Engineering11% of their works
  4. 4Civil and Structural Engineering9% of their works
  5. 5Polymers and Plastics6% of their works
  6. 6Dermatology3% of their works

Research topics

Which keywords describe Arvind Krishna's research?

The keywords of their largest research topics: High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Finite Element Analysis, Mechanical Behavior, Thermal Management, Interconnect and Through-Silicon Via.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 20 words, with their numbers
  1. High-Temperature Electronics112 topics
  2. Interfacial Reactions91 topic
  3. Lead-free Solders91 topic
  4. Finite Element Analysis82 topics
  5. Mechanical Behavior82 topics
  6. Thermal Management82 topics
  7. Interconnect61 topic
  8. Through-Silicon Via61 topic
  9. Cohesive Zone Models51 topic
  10. Delamination51 topic
  11. Composite Springs31 topic
  12. Vehicle Suspension31 topic
  13. CMOS Technology21 topic
  14. Design Optimization21 topic
  15. ESD Protection21 topic
  16. Reliability21 topic
  17. Structural Analysis21 topic
  18. Vibration-based Damage Identification21 topic
  19. Wide Bandgap Semiconductors21 topic
  20. Wireless Sensors21 topic

Where does Arvind Krishna work?

Arvind Krishna's main affiliation in the publication record is Aptiv (United States), United States.

How many publications and citations does Arvind Krishna have?

OpenAlex counts 24 works and 66 citations for Arvind Krishna, an h-index of 4, ranking #5,987,804 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named Arvind Krishna

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