Bioh Kim
Bioh Kim publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #5,880,044 of 7,710,434 ranked researchers
- Rank in Austria
- #36,045 of 43,330
- Works
- 43
- Citations
- 306
- Citations per work
- 7.1
What does Bioh Kim research?
Bioh Kim's work is mostly in Engineering (79%), Materials Science (5%), Physics and Astronomy (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences3786.8%
- Engineering3479.1%
- Materials Science25.4%
- Physics and Astronomy12.3%
- Everything else613.2%
- 1Electrical and Electronic Engineering62% of their works
- 2Automotive Engineering7% of their works
- 3Biomedical Engineering5% of their works
- 4Electronic, Optical and Magnetic Materials5% of their works
- 5Mechanical Engineering5% of their works
- 6Atomic and Molecular Physics, and Optics2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Copper Interconnects and Reliability
- Electrodeposition and Electroless Coatings
- Nanofabrication and Lithography Techniques
- Advanced Welding Techniques Analysis
- Semiconductor materials and interfaces
Which keywords describe Bioh Kim's research?
The keywords of their largest research topics: Electromigration, Nanoparticles, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Additive Manufacturing and 3D Printing.
- Metal-Semiconductor Contacts
- Processing
- Friction Stir Welding
- Composite Coatings
- Low-k Dielectrics
- 3D Printing
- Lead-free Solders
- Through-Silicon Via
- Nanoparticles
- Electromigration
- Interconnect
- Interfacial Reactions
- Additive Manufacturing
- Materials
- Microelectronics
- Electrodeposition
- Nanolithography
- Soft Lithography
- Schottky Barrier
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 19 words, with their numbers
- Electromigration382 topics
- Nanoparticles372 topics
- Interconnect351 topic
- Through-Silicon Via351 topic
- Interfacial Reactions311 topic
- Lead-free Solders311 topic
- Additive Manufacturing152 topics
- 3D Printing91 topic
- Materials91 topic
- Low-k Dielectrics71 topic
- Microelectronics71 topic
- Composite Coatings61 topic
- Electrodeposition61 topic
- Friction Stir Welding51 topic
- Nanolithography51 topic
- Processing51 topic
- Soft Lithography51 topic
- Metal-Semiconductor Contacts31 topic
- Schottky Barrier31 topic
Where does Bioh Kim work?
Bioh Kim's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Bioh Kim have?
OpenAlex counts 43 works and 306 citations for Bioh Kim, an h-index of 8, ranking #5,880,044 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
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