Christoph Flötgen
Christoph Flötgen publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Atomic and Molecular Physics, and Optics, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Semiconductor materials and devices.
- World rank
- #3,846,560 of 7,710,434 ranked researchers
- Rank in Austria
- #23,382 of 43,330
- Works
- 31
- Citations
- 438
- Citations per work
- 14.1
What does Christoph Flötgen research?
Christoph Flötgen's work is mostly in Engineering (82%), Physics and Astronomy (5%), Materials Science (4%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2890.6%
- Engineering2582.2%
- Physics and Astronomy14.8%
- Materials Science13.6%
- Everything else39.4%
- 1Electrical and Electronic Engineering68% of their works
- 2Automotive Engineering7% of their works
- 3Atomic and Molecular Physics, and Optics5% of their works
- 4Biomedical Engineering5% of their works
- 5Electronic, Optical and Magnetic Materials4% of their works
- 6Mechanics of Materials2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Additive Manufacturing and 3D Printing Technologies
- Silicon and Solar Cell Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Copper Interconnects and Reliability
- Semiconductor materials and interfaces
Which keywords describe Christoph Flötgen's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, Atomic Layer Deposition, High-k Dielectrics and 3D Printing.
- Silicon
- Microelectronics
- Low-k Dielectrics
- Failure Analysis
- Solar Cells
- 3D Printing
- Atomic Layer Deposition
- Interfacial Reactions
- Through-Silicon Via
- Interconnect
- Electromigration
- Lead-free Solders
- High-k Dielectrics
- Additive Manufacturing
- Efficiency
- Integrated Circuits
- Metal-Semiconductor Contacts
- Schottky Barrier
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- Interconnect201 topic
- Through-Silicon Via201 topic
- Electromigration162 topics
- Interfacial Reactions131 topic
- Lead-free Solders131 topic
- Atomic Layer Deposition71 topic
- High-k Dielectrics71 topic
- 3D Printing61 topic
- Additive Manufacturing61 topic
- Solar Cells62 topics
- Efficiency31 topic
- Failure Analysis31 topic
- Integrated Circuits31 topic
- Low-k Dielectrics31 topic
- Metal-Semiconductor Contacts31 topic
- Microelectronics31 topic
- Schottky Barrier31 topic
- Silicon31 topic
Where does Christoph Flötgen work?
Christoph Flötgen's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Christoph Flötgen have?
OpenAlex counts 31 works and 438 citations for Christoph Flötgen, an h-index of 9, ranking #3,846,560 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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