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Researcher · DfR Solutions (United States) · United States

Craig D. Hillman

Craig D. Hillman publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.

OpenAlex
World rank
#5,057,349
of 7,710,434 ranked researchers
Rank in United States
#1,308,489
of 1,627,098
Works
60
Citations
789
Citations per work
13.2
h-index
14
i10-index 15Top 33% in Electrical and Electronic Engineering
Craig D. Hillman

What does Craig D. Hillman research?

Craig D. Hillman's work is mostly in Engineering (73%), Materials Science (8%).

Physical Sciences: 48 works · 80.6% of their workEngineering: 44 works · 72.7% of their workElectrical and Electronic Engineering: 31 works · 51.7% of their workMechanical Engineering: 6 works · 10.8% of their workMechanics of Materials: 3 works · 5.7% of their workSafety, Risk, Reliability and Quality: 3 works · 4.5% of their workMaterials Science: 5 works · 7.9% of their workMaterials Chemistry: 3 works · 4.5% of their workElectronic, Optical and Magnetic Materials: 2 works · 3.4% of their workEverything else: 12 works · 19.4% of their workTHEIR WORKCraig D. Hillman60works
Physical Sciences81%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering4472.7%
    2. Materials Science57.9%
  2. Everything else1219.4%
  1. 1Electrical and Electronic Engineering52% of their works
  2. 2Mechanical Engineering11% of their works
  3. 3Mechanics of Materials6% of their works
  4. 4Materials Chemistry4% of their works
  5. 5Safety, Risk, Reliability and Quality4% of their works
  6. 6Electronic, Optical and Magnetic Materials3% of their works

Research topics

Which keywords describe Craig D. Hillman's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Failure Analysis, Integrated Circuits and Inkjet Printing.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Electromigration432 topics
  2. Interfacial Reactions371 topic
  3. Lead-free Solders371 topic
  4. Interconnect171 topic
  5. Through-Silicon Via171 topic
  6. Failure Analysis91 topic
  7. Integrated Circuits91 topic
  8. Inkjet Printing71 topic
  9. Transparent Electrodes71 topic
  10. Electrical Contact Materials61 topic
  11. Low-k Dielectrics61 topic
  12. Microelectronics61 topic
  13. Pantograph-Catenary Interaction61 topic
  14. Atomic Layer Deposition51 topic
  15. High-k Dielectrics51 topic
  16. Ductile Fracture41 topic
  17. Sheet Metal Forming41 topic

Where does Craig D. Hillman work?

Craig D. Hillman's main affiliation in the publication record is DfR Solutions (United States), United States.

How many publications and citations does Craig D. Hillman have?

OpenAlex counts 60 works and 789 citations for Craig D. Hillman, an h-index of 14, ranking #5,057,349 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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