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Researcher · Hunan Communications Research Institute · China

Dayuan Jin

Dayuan Jin publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Multi-Objective Optimization Algorithms.

OpenAlex
World rank
#5,311,093
of 7,710,434 ranked researchers
Rank in China
#781,031
of 978,568
Works
16
Citations
11
Citations per work
0.7
h-index
2
i10-index 0Top 99.1% in Electrical and Electronic Engineering
Dayuan Jin

What does Dayuan Jin research?

Dayuan Jin's work is mostly in Engineering (64%), Computer Science (5%), Decision Sciences (5%).

Physical Sciences: 11 works · 68.4% of their workEngineering: 10 works · 63.5% of their workElectrical and Electronic Engineering: 7 works · 41.5% of their workMechanical Engineering: 2 works · 9.8% of their workAerospace Engineering: 1 works · 7.3% of their workAutomotive Engineering: 1 works · 4.9% of their workComputer Science: 1 works · 4.9% of their workComputational Theory and Mathematics: 1 works · 4.9% of their workEverything else: 4 works · 26.7% of their workSocial Sciences: 1 works · 4.9% of their workDecision Sciences: 1 works · 4.9% of their workManagement Science and Operations Research: 1 works · 4.9% of their workTHEIR WORKDayuan Jin16works
Physical Sciences68%Social Sciences5%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1063.5%
    2. Computer Science14.9%
  2. Everything else426.7%
    1. Decision Sciences14.9%
  1. 1Electrical and Electronic Engineering42% of their works
  2. 2Mechanical Engineering10% of their works
  3. 3Aerospace Engineering7% of their works
  4. 4Automotive Engineering5% of their works
  5. 5Management Science and Operations Research5% of their works
  6. 6Computational Theory and Mathematics5% of their works

Research topics

Which keywords describe Dayuan Jin's research?

The keywords of their largest research topics: Thermal Management, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, 3D Printing, Additive Manufacturing and Assembly Planning.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Thermal Management82 topics
  2. Interfacial Reactions71 topic
  3. Lead-free Solders71 topic
  4. Interconnect61 topic
  5. Through-Silicon Via61 topic
  6. 3D Printing21 topic
  7. Additive Manufacturing21 topic
  8. Assembly Planning21 topic
  9. Design for Manufacture21 topic
  10. Evolutionary Algorithms21 topic
  11. Failure Analysis21 topic
  12. Heat Transfer21 topic
  13. Integrated Circuits21 topic
  14. Microchannel21 topic
  15. Multiobjective Optimization21 topic
  16. Digital Media Technology11 topic
  17. Visual Communication Design11 topic

Where does Dayuan Jin work?

Dayuan Jin's main affiliation in the publication record is Hunan Communications Research Institute, China.

How many publications and citations does Dayuan Jin have?

OpenAlex counts 16 works and 11 citations for Dayuan Jin, an h-index of 2, ranking #5,311,093 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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