Eric Kuah
Eric Kuah publishes mostly in Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #3,366,925 of 7,710,434 ranked researchers
- Rank in China
- #528,729 of 978,568
- Works
- 27
- Citations
- 762
- Citations per work
- 28.2
What does Eric Kuah research?
Eric Kuah's work is mostly in Engineering (87%), Materials Science (7%), Computer Science (3%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2696.0%
- Engineering2386.8%
- Materials Science26.6%
- Computer Science12.6%
- Everything else14.0%
- 1Electrical and Electronic Engineering76% of their works
- 2Electronic, Optical and Magnetic Materials7% of their works
- 3Biomedical Engineering5% of their works
- 4Mechanics of Materials3% of their works
- 5Mechanical Engineering3% of their works
- 6Computer Vision and Pattern Recognition3% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Copper Interconnects and Reliability
- Nanofabrication and Lithography Techniques
- Music Technology and Sound Studies
- Material Properties and Processing
- Advanced Data Storage Technologies
Which keywords describe Eric Kuah's research?
The keywords of their largest research topics: Electromigration, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Electromagnetic Compatibility, EMI and Low-k Dielectrics.
- Distributed Storage
- Music Generation
- Fiber Networks
- Nanolithography
- Low-k Dielectrics
- EMI
- Lead-free Solders
- Interconnect
- Electromigration
- Interfacial Reactions
- Through-Silicon Via
- Electromagnetic Compatibility
- Microelectronics
- Soft Lithography
- Interactive Evolutionary Computation
- Paper Mechanics
- Network Coding
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Electromigration282 topics
- Interconnect231 topic
- Interfacial Reactions231 topic
- Lead-free Solders231 topic
- Through-Silicon Via231 topic
- EMI101 topic
- Electromagnetic Compatibility101 topic
- Low-k Dielectrics51 topic
- Microelectronics51 topic
- Nanolithography31 topic
- Soft Lithography31 topic
- Fiber Networks21 topic
- Interactive Evolutionary Computation21 topic
- Music Generation21 topic
- Paper Mechanics21 topic
- Distributed Storage11 topic
- Network Coding11 topic
Where does Eric Kuah work?
Eric Kuah's main affiliation in the publication record is ASM Pacific Technology (China), China.
How many publications and citations does Eric Kuah have?
OpenAlex counts 27 works and 762 citations for Eric Kuah, an h-index of 13, ranking #3,366,925 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
Discussion
Ask a question or share a note about Eric Kuah. Keep it to the research: no personal attacks, advertising or links. Any reader can report a post, which collapses it for everyone until it is opened.