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Researcher · Advanced Semiconductor Engineering (Taiwan) · Taiwan

Ho‐Ming Tong

Ho‐Ming Tong publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Neuroscience and Neural Engineering.

OpenAlex
World rank
#5,381,272
of 7,710,434 ranked researchers
Rank in Taiwan
#41,328
of 57,035
Works
45
Citations
598
Citations per work
13.3
h-index
11
i10-index 12Top 47% in Electrical and Electronic Engineering
Ho‐Ming Tong

What does Ho‐Ming Tong research?

Ho‐Ming Tong's work is mostly in Engineering (79%), Neuroscience (5%), Materials Science (5%).

Physical Sciences: 38 works · 83.8% of their workEngineering: 36 works · 79.1% of their workElectrical and Electronic Engineering: 26 works · 58.1% of their workBiomedical Engineering: 4 works · 9.3% of their workMechanical Engineering: 3 works · 7.0% of their workAutomotive Engineering: 2 works · 4.7% of their workMaterials Science: 2 works · 4.7% of their workPolymers and Plastics: 2 works · 4.7% of their workEverything else: 5 works · 11.5% of their workLife Sciences: 2 works · 4.7% of their workNeuroscience: 2 works · 4.7% of their workCellular and Molecular Neuroscience: 2 works · 4.7% of their workTHEIR WORKHo‐Ming Tong45works
Life Sciences5%Physical Sciences84%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3679.1%
    2. Materials Science24.7%
  2. Everything else511.5%
    1. Neuroscience24.7%
  1. 1Electrical and Electronic Engineering58% of their works
  2. 2Biomedical Engineering9% of their works
  3. 3Mechanical Engineering7% of their works
  4. 4Automotive Engineering5% of their works
  5. 5Cellular and Molecular Neuroscience5% of their works
  6. 6Polymers and Plastics5% of their works

Research topics

Which keywords describe Ho‐Ming Tong's research?

The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing, Electrode Arrays and Neural Stimulation.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 16 words, with their numbers
  1. Interconnect291 topic
  2. Through-Silicon Via291 topic
  3. Interfacial Reactions241 topic
  4. Lead-free Solders241 topic
  5. 3D Printing61 topic
  6. Additive Manufacturing61 topic
  7. Electrode Arrays61 topic
  8. Neural Stimulation61 topic
  9. Atomic Layer Deposition41 topic
  10. CMOS41 topic
  11. High-k Dielectrics41 topic
  12. Low-Power41 topic
  13. Memristor41 topic
  14. Nanolithography41 topic
  15. Neuromorphic Computing41 topic
  16. Soft Lithography41 topic

Where does Ho‐Ming Tong work?

Ho‐Ming Tong's main affiliation in the publication record is Advanced Semiconductor Engineering (Taiwan), Taiwan.

How many publications and citations does Ho‐Ming Tong have?

OpenAlex counts 45 works and 598 citations for Ho‐Ming Tong, an h-index of 11, ranking #5,381,272 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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