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Researcher · AT&T (United States) · United States

Jean‐Paul Clech

Jean‐Paul Clech publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Fatigue and fracture mechanics.

OpenAlex
World rank
#4,145,582
of 7,710,434 ranked researchers
Rank in United States
#1,122,515
of 1,627,098
Works
17
Citations
313
Citations per work
18.4
h-index
10
i10-index 10Top 52% in Electrical and Electronic Engineering
Jean‐Paul Clech

What does Jean‐Paul Clech research?

Jean‐Paul Clech's work is mostly in Engineering (83%), Decision Sciences (6%), Medicine (4%).

Physical Sciences: 14 works · 82.7% of their workEngineering: 14 works · 82.7% of their workElectrical and Electronic Engineering: 7 works · 43.5% of their workMechanics of Materials: 4 works · 26.1% of their workMechanical Engineering: 2 works · 10.9% of their workAerospace Engineering: 0 works · 2.2% of their workSocial Sciences: 1 works · 6.5% of their workDecision Sciences: 1 works · 6.5% of their workStatistics, Probability and Uncertainty: 1 works · 6.5% of their workEverything else: 1 works · 6.5% of their workHealth Sciences: 1 works · 4.3% of their workMedicine: 1 works · 4.3% of their workSurgery: 1 works · 4.3% of their workTHEIR WORKJean‐Paul Clech17works
Physical Sciences83%Health Sciences4%Social Sciences6%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1482.7%
    1. Decision Sciences16.5%
  3. Everything else16.5%
    1. Medicine14.3%
  1. 1Electrical and Electronic Engineering44% of their works
  2. 2Mechanics of Materials26% of their works
  3. 3Mechanical Engineering11% of their works
  4. 4Statistics, Probability and Uncertainty6% of their works
  5. 5Surgery4% of their works
  6. 6Aerospace Engineering2% of their works

Research topics

Which keywords describe Jean‐Paul Clech's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Fracture, Interconnect, Through-Silicon Via, Fatigue Crack Closure, Fracture Toughness Testing and Acoustic Emission.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 17 words, with their numbers
  1. Interfacial Reactions111 topic
  2. Lead-free Solders111 topic
  3. Fracture52 topics
  4. Interconnect51 topic
  5. Through-Silicon Via51 topic
  6. Fatigue Crack Closure41 topic
  7. Fracture Toughness Testing41 topic
  8. Acoustic Emission31 topic
  9. Rock Mechanics31 topic
  10. Sensitivity Analysis31 topic
  11. Uncertainty Quantification31 topic
  12. Extended Finite Element Method21 topic
  13. Failure Analysis21 topic
  14. High-Temperature Alloys21 topic
  15. Integrated Circuits21 topic
  16. Meshless Methods21 topic
  17. Superalloys21 topic

Where does Jean‐Paul Clech work?

Jean‐Paul Clech's main affiliation in the publication record is AT&T (United States), United States.

How many publications and citations does Jean‐Paul Clech have?

OpenAlex counts 17 works and 313 citations for Jean‐Paul Clech, an h-index of 10, ranking #4,145,582 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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