Julian Bravin
Julian Bravin publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Computational Mechanics, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #7,058,172 of 7,710,434 ranked researchers
- Rank in Austria
- #41,006 of 43,330
- Works
- 28
- Citations
- 68
- Citations per work
- 2.4
What does Julian Bravin research?
Julian Bravin's work is mostly in Engineering (94%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2694.0%
- Engineering2694.0%
- Everything else26.0%
- 1Electrical and Electronic Engineering62% of their works
- 2Automotive Engineering11% of their works
- 3Computational Mechanics10% of their works
- 4Biomedical Engineering7% of their works
- 5Industrial and Manufacturing Engineering2% of their works
- 6Mechanical Engineering2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Laser Material Processing Techniques
- Nanofabrication and Lithography Techniques
- Advancements in Photolithography Techniques
- Advanced Surface Polishing Techniques
- Semiconductor materials and devices
Which keywords describe Julian Bravin's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing, Femtosecond Laser and Micromachining.
- High-k Dielectrics
- Atomic Layer Deposition
- Electron Beam Lithography
- Nanolithography
- Micromachining
- Additive Manufacturing
- Lead-free Solders
- Through-Silicon Via
- Interconnect
- Interfacial Reactions
- 3D Printing
- Femtosecond Laser
- High-Resolution Patterning
- Soft Lithography
- Nanofabrication
- Chemical Mechanical Planarization
- Material Removal Mechanism
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 17 words, with their numbers
- Interconnect231 topic
- Through-Silicon Via231 topic
- Interfacial Reactions161 topic
- Lead-free Solders161 topic
- 3D Printing91 topic
- Additive Manufacturing91 topic
- Femtosecond Laser81 topic
- Micromachining81 topic
- High-Resolution Patterning72 topics
- Nanolithography41 topic
- Soft Lithography41 topic
- Electron Beam Lithography31 topic
- Nanofabrication31 topic
- Atomic Layer Deposition21 topic
- Chemical Mechanical Planarization21 topic
- High-k Dielectrics21 topic
- Material Removal Mechanism21 topic
Where does Julian Bravin work?
Julian Bravin's main affiliation in the publication record is EV Group (Austria), Austria.
How many publications and citations does Julian Bravin have?
OpenAlex counts 28 works and 68 citations for Julian Bravin, an h-index of 5, ranking #7,058,172 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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