Karel Dušek
Karel Dušek publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science, on topics such as Electronic Packaging and Soldering Technologies, Integrated Circuits and Semiconductor Failure Analysis and 3D IC and TSV technologies.
- World rank
- #841,520 of 1,633,909 ranked researchers
- Rank in Czechia
- #3,007 of 9,029
- Works
- 39
- Citations
- 48
- Citations per work
- 1.2
What does Karel Dušek research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering46% of their works
- 2Mechanical Engineering18% of their works
- 3General Materials Science7% of their works
- 4Materials Chemistry4% of their works
- 5Electronic, Optical and Magnetic Materials4% of their works
- 6Industrial and Manufacturing Engineering4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Aluminum Alloys Composites Properties
- Metallurgical and Alloy Processes
- Manufacturing Process and Optimization
- Electron and X-Ray Spectroscopy Techniques
- Additive Manufacturing and 3D Printing Technologies
Which keywords describe Karel Dušek's research?
The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Mechanical Properties, Microstructure, Failure Analysis, Integrated Circuits and Interconnect.
- 3D Printing
- Scanning Electron Microscopy
- Assembly Planning
- Phase Diagrams
- Alloys
- Interconnect
- Failure Analysis
- Mechanical Properties
- Interfacial Reactions
- Nanoparticles
- Lead-free Solders
- Microstructure
- Integrated Circuits
- Through-Silicon Via
- Metal Matrix Composites
- Reinforcement
- Design for Manufacture
- X-ray Photoelectron Spectroscopy
- Additive Manufacturing
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- Nanoparticles142 topics
- Interfacial Reactions111 topic
- Lead-free Solders111 topic
- Mechanical Properties62 topics
- Microstructure62 topics
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Interconnect41 topic
- Through-Silicon Via41 topic
- Alloys31 topic
- Metal Matrix Composites31 topic
- Phase Diagrams31 topic
- Reinforcement31 topic
- Assembly Planning21 topic
- Design for Manufacture21 topic
- Scanning Electron Microscopy21 topic
- X-ray Photoelectron Spectroscopy21 topic
- 3D Printing11 topic
- Additive Manufacturing11 topic
Where does Karel Dušek work?
Karel Dušek's main affiliation in the publication record is Czech Technical University in Prague, Czechia.
How many publications and citations does Karel Dušek have?
Science Explorer counts 39 works and 48 citations for Karel Dušek, ranking #841,520 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Karel Dušek
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