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Researcher · ROHM · Japan

Keisuke Wakamoto

Keisuke Wakamoto publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Aluminum Alloys Composites Properties.

ORCID 0000-0002-9302-7223 OpenAlex
World rank
#5,098,022
of 7,710,434 ranked researchers
Rank in Japan
#162,732
of 383,136
Works
42
Citations
313
Citations per work
7.5
h-index
10
i10-index 10Top 52% in Electrical and Electronic Engineering
Keisuke Wakamoto

What does Keisuke Wakamoto research?

Keisuke Wakamoto's work is mostly in Engineering (73%), Materials Science (14%).

Physical Sciences: 36 works · 86.9% of their workEngineering: 31 works · 72.9% of their workElectrical and Electronic Engineering: 18 works · 43.0% of their workMechanical Engineering: 9 works · 21.5% of their workComputational Mechanics: 2 works · 4.7% of their workMechanics of Materials: 2 works · 3.7% of their workMaterials Science: 6 works · 14.0% of their workElectronic, Optical and Magnetic Materials: 3 works · 7.5% of their workMaterials Chemistry: 3 works · 6.5% of their workEverything else: 6 works · 13.1% of their workTHEIR WORKKeisuke Wakamoto42works
Physical Sciences87%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3172.9%
    2. Materials Science614.0%
  2. Everything else613.1%
  1. 1Electrical and Electronic Engineering43% of their works
  2. 2Mechanical Engineering22% of their works
  3. 3Electronic, Optical and Magnetic Materials8% of their works
  4. 4Materials Chemistry6% of their works
  5. 5Computational Mechanics5% of their works
  6. 6Mechanics of Materials4% of their works

Research topics

Which keywords describe Keisuke Wakamoto's research?

The keywords of their largest research topics: Nanoparticles, Electromigration, High-Temperature Electronics, Interfacial Reactions, Lead-free Solders, Mechanical Properties, Thermal Management and Interconnect.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 21 words, with their numbers
  1. Nanoparticles312 topics
  2. Electromigration302 topics
  3. High-Temperature Electronics262 topics
  4. Interfacial Reactions221 topic
  5. Lead-free Solders221 topic
  6. Mechanical Properties142 topics
  7. Thermal Management142 topics
  8. Interconnect101 topic
  9. Through-Silicon Via101 topic
  10. Metal Matrix Composites91 topic
  11. Reinforcement91 topic
  12. Low-k Dielectrics81 topic
  13. Microelectronics81 topic
  14. Compaction51 topic
  15. Powder Metallurgy51 topic
  16. Ion Beam41 topic
  17. Nanodiamonds41 topic
  18. Quantum Sensing41 topic
  19. Reliability41 topic
  20. Surface Analysis41 topic
  21. Wide Bandgap Semiconductors41 topic

Where does Keisuke Wakamoto work?

Keisuke Wakamoto's main affiliation in the publication record is ROHM, Japan.

How many publications and citations does Keisuke Wakamoto have?

OpenAlex counts 42 works and 313 citations for Keisuke Wakamoto, an h-index of 10, ranking #5,098,022 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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