Lakshmanan Karuppiah
Lakshmanan Karuppiah publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering, on topics such as Advanced Surface Polishing Techniques, Copper Interconnects and Reliability and 3D IC and TSV technologies.
- World rank
- #6,246,869 of 7,710,434 ranked researchers
- Rank in Germany
- #317,241 of 364,343
- Works
- 18
- Citations
- 50
- Citations per work
- 2.8
What does Lakshmanan Karuppiah research?
Lakshmanan Karuppiah's work is mostly in Engineering (76%), Materials Science (14%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1690.1%
- Engineering1476.4%
- Materials Science213.7%
- Everything else29.9%
- 1Electrical and Electronic Engineering29% of their works
- 2Biomedical Engineering24% of their works
- 3Mechanical Engineering18% of their works
- 4Electronic, Optical and Magnetic Materials14% of their works
- 5Mechanics of Materials4% of their works
- 6Aerospace Engineering2% of their works
Research topics
- Advanced Surface Polishing Techniques
- Copper Interconnects and Reliability
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Advancements in Photolithography Techniques
- Advanced machining processes and optimization
- Electronic Packaging and Soldering Technologies
- Metallurgy and Material Forming
Which keywords describe Lakshmanan Karuppiah's research?
The keywords of their largest research topics: Tool Wear, Chemical Mechanical Planarization, Material Removal Mechanism, Electromigration, Low-k Dielectrics, Microelectronics, Interconnect and Through-Silicon Via.
- Lead-free Solders
- Hot Deformation
- Surface Integrity
- Machining
- High-k Dielectrics
- Through-Silicon Via
- Microelectronics
- Electromigration
- Chemical Mechanical Planarization
- Tool Wear
- Material Removal Mechanism
- Low-k Dielectrics
- Interconnect
- Atomic Layer Deposition
- Electron Beam Lithography
- Nanofabrication
- Dynamic Recrystallization
- Interfacial Reactions
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 18 words, with their numbers
- Tool Wear142 topics
- Chemical Mechanical Planarization111 topic
- Material Removal Mechanism111 topic
- Electromigration92 topics
- Low-k Dielectrics71 topic
- Microelectronics71 topic
- Interconnect51 topic
- Through-Silicon Via51 topic
- Atomic Layer Deposition41 topic
- High-k Dielectrics41 topic
- Electron Beam Lithography31 topic
- Machining31 topic
- Nanofabrication31 topic
- Surface Integrity31 topic
- Dynamic Recrystallization21 topic
- Hot Deformation21 topic
- Interfacial Reactions21 topic
- Lead-free Solders21 topic
Where does Lakshmanan Karuppiah work?
Lakshmanan Karuppiah's main affiliation in the publication record is Applied Materials (Germany), Germany.
How many publications and citations does Lakshmanan Karuppiah have?
OpenAlex counts 18 works and 50 citations for Lakshmanan Karuppiah, an h-index of 4, ranking #6,246,869 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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