M. Jürgen Wolf
M. Jürgen Wolf publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #4,165,151 of 7,710,434 ranked researchers
- Rank in Germany
- #210,316 of 364,343
- Works
- 49
- Citations
- 813
- Citations per work
- 16.6
What does M. Jürgen Wolf research?
M. Jürgen Wolf's work is mostly in Engineering (78%), Materials Science (5%), Chemical Engineering (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences4286.4%
- Engineering3877.8%
- Materials Science25.0%
- Chemical Engineering12.2%
- Computer Science11.4%
- Everything else713.6%
- 1Electrical and Electronic Engineering61% of their works
- 2Biomedical Engineering11% of their works
- 3Automotive Engineering6% of their works
- 4Electronic, Optical and Magnetic Materials5% of their works
- 5Bioengineering2% of their works
- 6Computer Networks and Communications1% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Copper Interconnects and Reliability
- Advanced Surface Polishing Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Gas Sensing Nanomaterials and Sensors
Which keywords describe M. Jürgen Wolf's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Electromigration, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Low-k Dielectrics.
- High-k Dielectrics
- Atomic Layer Deposition
- Integrated Circuits
- Chemical Mechanical Planarization
- Low-k Dielectrics
- 3D Printing
- Interfacial Reactions
- Through-Silicon Via
- Interconnect
- Electromigration
- Lead-free Solders
- Additive Manufacturing
- Microelectronics
- Failure Analysis
- Material Removal Mechanism
- Gas Sensors
- Metal Oxide
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Interconnect331 topic
- Through-Silicon Via331 topic
- Electromigration302 topics
- Interfacial Reactions231 topic
- Lead-free Solders231 topic
- 3D Printing81 topic
- Additive Manufacturing81 topic
- Low-k Dielectrics71 topic
- Microelectronics71 topic
- Chemical Mechanical Planarization61 topic
- Failure Analysis61 topic
- Integrated Circuits61 topic
- Material Removal Mechanism61 topic
- Atomic Layer Deposition41 topic
- Gas Sensors41 topic
- High-k Dielectrics41 topic
- Metal Oxide41 topic
Where does M. Jürgen Wolf work?
M. Jürgen Wolf's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.
How many publications and citations does M. Jürgen Wolf have?
OpenAlex counts 49 works and 813 citations for M. Jürgen Wolf, an h-index of 15, ranking #4,165,151 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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