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Researcher · Henkel (United States) · United States

Michael G. Todd

Michael G. Todd publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Dielectric materials and actuators.

OpenAlex
World rank
#3,010,400
of 7,710,434 ranked researchers
Rank in United States
#863,814
of 1,627,098
Works
29
Citations
662
Citations per work
22.8
h-index
9
i10-index 8Top 59% in Electrical and Electronic Engineering
Michael G. Todd

What does Michael G. Todd research?

Michael G. Todd's work is mostly in Engineering (69%), Materials Science (8%).

Physical Sciences: 22 works · 76.9% of their workEngineering: 20 works · 68.9% of their workElectrical and Electronic Engineering: 12 works · 42.5% of their workBiomedical Engineering: 3 works · 11.5% of their workMechanics of Materials: 3 works · 10.3% of their workMechanical Engineering: 1 works · 4.6% of their workMaterials Science: 2 works · 8.0% of their workElectronic, Optical and Magnetic Materials: 1 works · 4.6% of their workGeneral Materials Science: 1 works · 3.4% of their workEverything else: 7 works · 23.1% of their workTHEIR WORKMichael G. Todd29works
Physical Sciences77%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2068.9%
    2. Materials Science28.0%
  2. Everything else723.1%
  1. 1Electrical and Electronic Engineering42% of their works
  2. 2Biomedical Engineering12% of their works
  3. 3Mechanics of Materials10% of their works
  4. 4Mechanical Engineering5% of their works
  5. 5Electronic, Optical and Magnetic Materials5% of their works
  6. 6General Materials Science3% of their works

Research topics

Which keywords describe Michael G. Todd's research?

The keywords of their largest research topics: Electromigration, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Dielectric Elastomers, Fiber Networks and High Permittivity Polymer Composites.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 17 words, with their numbers
  1. Electromigration222 topics
  2. Interfacial Reactions181 topic
  3. Lead-free Solders181 topic
  4. Interconnect131 topic
  5. Through-Silicon Via131 topic
  6. Dielectric Elastomers61 topic
  7. Fiber Networks61 topic
  8. High Permittivity Polymer Composites61 topic
  9. Paper Mechanics61 topic
  10. Low-k Dielectrics41 topic
  11. Microelectronics41 topic
  12. EMI31 topic
  13. Electromagnetic Compatibility31 topic
  14. 3D Printing21 topic
  15. Additive Manufacturing21 topic
  16. Embedded Cores21 topic
  17. Test Data Compression21 topic

Where does Michael G. Todd work?

Michael G. Todd's main affiliation in the publication record is Henkel (United States), United States.

How many publications and citations does Michael G. Todd have?

OpenAlex counts 29 works and 662 citations for Michael G. Todd, an h-index of 9, ranking #3,010,400 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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