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Researcher · NXP (Netherlands) · Netherlands

Poh Leng Eu

Poh Leng Eu publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Integrated Circuits and Semiconductor Failure Analysis.

OpenAlex
World rank
#5,839,434
of 7,710,434 ranked researchers
Rank in Netherlands
#97,210
of 107,149
Works
17
Citations
144
Citations per work
8.5
h-index
7
i10-index 4Top 74% in Electrical and Electronic Engineering
Poh Leng Eu

What does Poh Leng Eu research?

Poh Leng Eu's work is mostly in Engineering (90%), Materials Science (10%).

Physical Sciences: 17 works · 100.0% of their workEngineering: 15 works · 90.2% of their workElectrical and Electronic Engineering: 10 works · 60.8% of their workMechanical Engineering: 2 works · 13.7% of their workMechanics of Materials: 2 works · 9.8% of their workBiomedical Engineering: 1 works · 3.9% of their workAerospace Engineering: 0 works · 2.0% of their workMaterials Science: 2 works · 9.8% of their workMaterials Chemistry: 2 works · 9.8% of their workTHEIR WORKPoh Leng Eu17works
Physical Sciences100%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1590.2%
    2. Materials Science29.8%
  1. 1Electrical and Electronic Engineering61% of their works
  2. 2Mechanical Engineering14% of their works
  3. 3Materials Chemistry10% of their works
  4. 4Mechanics of Materials10% of their works
  5. 5Biomedical Engineering4% of their works
  6. 6Aerospace Engineering2% of their works

Research topics

Which keywords describe Poh Leng Eu's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Constitutive Modeling, Microstructural Evolution, Dynamic Deformation and Dynamic Recrystallization.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.

All 18 words, with their numbers
  1. Interfacial Reactions161 topic
  2. Lead-free Solders161 topic
  3. Interconnect91 topic
  4. Through-Silicon Via91 topic
  5. Constitutive Modeling62 topics
  6. Microstructural Evolution62 topics
  7. Dynamic Deformation31 topic
  8. Dynamic Recrystallization31 topic
  9. Failure Analysis31 topic
  10. Friction Stir Welding31 topic
  11. High Strain Rate31 topic
  12. Hot Deformation31 topic
  13. Integrated Circuits31 topic
  14. Processing31 topic
  15. CMOS Technology21 topic
  16. Chemical Mechanical Planarization21 topic
  17. ESD Protection21 topic
  18. Material Removal Mechanism21 topic

Where does Poh Leng Eu work?

Poh Leng Eu's main affiliation in the publication record is NXP (Netherlands), Netherlands.

How many publications and citations does Poh Leng Eu have?

OpenAlex counts 17 works and 144 citations for Poh Leng Eu, an h-index of 7, ranking #5,839,434 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

Discussion

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